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NXP PMIC-電源管理-專業

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類別半導體 / 電源管理IC / PMIC-電源管理-專業
制造商NXP USA Inc.
記錄 595
頁面 14/20
圖片
型號
制造商
描述
庫存
數量
系列
應用程序
電流-電源
電壓-供電
工作溫度
安裝類型
包裝/箱
供應商設備包裝
MC35FS4502NAE
NXP
FS4500
7,128
Automotive, AEC-Q100
System Basis Chip
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6512LAE
NXP
SYSTEM BASIS CHIP DCDC 1.5A VCO
3,096
-
System Basis Chip
-
1V ~ 5V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6513NAE
NXP
SYSTEM BASIS CHIP DCDC 1.5A VCO
5,850
-
System Basis Chip
-
1V ~ 5V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC34708VMR2
NXP
IC POWER MANAGEMENT 206MAPBGA
2,862
-
General Purpose
-
1.8V ~ 4.5V
-40°C ~ 85°C
Surface Mount
206-LFBGA
206-MAPBGA (13x13)
MC34PF8100A0EP
NXP
IC POWER MANAGEMENT
3,636
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC34PF8100CCEP
NXP
IC POWER MANAGEMENT I.MX8QXP
6,102
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC34PF8100CHEP
NXP
IC POWER MANAGEMENT I.MX8QM
6,516
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC34PF8100CFEP
NXP
IC POWER MANAGEMENT I.MX8QXP
4,644
-
High Performance i.MX 8, S32x Processor Based
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC34PF8100EPEP
NXP
IC POWER MANAGEMENT I.MX8QM
8,244
-
High Performance i.MX 8, S32x Processor Based
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC34PF8100EQEP
NXP
IC POWER MANAGEMENT I.MX8QM
8,946
-
High Performance i.MX 8, S32x Processor Based
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC34PF8100EREP
NXP
IC POWER MANAGEMENT I.MX8QM
8,028
-
High Performance i.MX 8, S32x Processor Based
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC35FS6502NAE
NXP
FS6500
4,824
Automotive, AEC-Q100
System Basis Chip
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS6513CAER2
NXP
SBC, DCDC 1.5A VCORE FS1B CAN,15
7,596
Automotive, AEC-Q100
System Basis Chip
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MCZ33800EK
NXP
IC ENGINE CTRL SW/DVR 54-SOIC
6,642
-
Automotive
10mA
5V ~ 36V
-40°C ~ 125°C
Surface Mount
54-SSOP (0.295", 7.50mm Width) Exposed Pad
54-SOIC-EP
MC35FS6503CAER2
NXP
FS6500
5,994
Automotive, AEC-Q100
System Basis Chip
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6523NAE
NXP
SYSTEM BASIS CHIP DCDC 2.2A VCO
8,964
-
System Basis Chip
-
1V ~ 5V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS6511NAE
NXP
FS6500
3,384
Automotive, AEC-Q100
System Basis Chip
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6504LAE
NXP
SYSTEM BASIS CHIP DCDC 0.8A VCO
4,626
-
System Basis Chip
-
1V ~ 5V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS4501CAE
NXP
FS4500
6,066
Automotive, AEC-Q100
System Basis Chip
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33PF8100CDES
NXP
IC POWER MANAGEMENT I.MX8QM
5,922
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8100CEES
NXP
IC POWER MANAGEMENT I.MX8QM
7,848
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8100CFES
NXP
IC POWER MANAGEMENT I.MX8QXP
4,284
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8100CHES
NXP
IC POWER MANAGEMENT I.MX8QM
7,236
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8100EAES
NXP
IC POWER MANAGEMENT LS1046A
5,256
-
High Performance i.MX 8, S32x Processor Based
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8100EPES
NXP
IC POWER MANAGEMENT I.MX8QM
1,292
-
High Performance i.MX 8, S32x Processor Based
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8100EQES
NXP
IC POWER MANAGEMENT I.MX8QM
108
-
High Performance i.MX 8, S32x Processor Based
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8100ERES
NXP
IC POWER MANAGEMENT I.MX8QM
7,614
-
High Performance i.MX 8, S32x Processor Based
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC35FS6512NAE
NXP
FS6500
2,826
Automotive, AEC-Q100
System Basis Chip
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS6501CAE
NXP
FS6500
3,472
Automotive, AEC-Q100
System Basis Chip
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6513CAE
NXP
SYSTEM BASIS CHIP DCDC 1.5A VCO
2,502
-
System Basis Chip
-
1V ~ 5V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)