Infineon introduces the second generation of embedded power devices TLE983x

     Infineon Technologies AG introduces the second generation of Embedded Power Devices (ePower). The new TLE983x System on Chip (SoC) product family integrates a powerful 8-bit single chip with LIN transceivers and related peripherals on a single chip to meet the needs of space - and cost-sensitive body applications.

     The new device has been specifically designed for a wide variety of LIN servo motor control applications, including window lifters, wipers, sunroofs, power seats and fan/blower control. Small package and small number of external components are the basic requirements for chips in such applications. The device can also be used in space-limited LIN servo applications, such as keyboard interfaces and switchboard interfaces.

     Refined with Infineon's industry-first 130nm Smart Power technology, which meets the quality requirements of the automotive industry, the new SoC offers an unparalleled level of integration. The compact VQFN-48 package measures just 7 mm x 7 mm, which is about 50% smaller than the original device. Compared to the previous generation TLE78xx multi-chip modular device, the single-chip TLE983x device offers improved CPU performance, higher Flash memory capacity, more high-voltage monitoring inputs, a smaller form factor, and lower cost.

     Andreas Doll, Vice President and General Manager of the Body Power Devices Business Unit, Automotive Electronics Division, Infineon Technologies AG, said: "The new generation of ePower devices from Infineon is a system-on-chip semiconductor solution that combines all the functions needed to detect, control and drive motors for space - and cost-critical body applications. This product provides automotive designers with greater design flexibility by reducing board space, circuit complexity, power consumption and material costs."