Molex launches end-to-end high speed channel solutions portfolio

     Molex offers a comprehensive and broad portfolio of industry-leading end-to-end high-speed channel solutions supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand enhanced Data rate (EDR) applications. Increase data rates in mobile telecommunications and data communication storage and networking applications to minimize crosstalk and maximize signal integrity.

     Joe Dambach, Global New Product Development Manager at Molex, said: "Customers today demand faster, denser systems to meet the needs of tomorrow's bandwidth-hungry users. They can benefit from cost-effective solutions that are future-proof and capable of delivering high-performance interoperability. Molex cables and connectors ensure that users can optimize end-to-end high-speed channels for next-generation data rates."

     A typical high-speed network connection channel can start with the zSFP+ enhanced small size pluggable surface mount technology I/O connector to receive data (such as a signal) entering the switch chassis. The enhanced zSFP+ 20-way connector provides excellent performance for high-speed telecommunications and data communication equipment. Molex Scalable zSFP+ connector products are designed for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel with optimal EMI and signal integrity. The signal is then transmitted to the motherboard via a SEARAY† board-to-board intermediate connector.

     Signals are transmitted at data rates of up to 25 Gbps via Impact Orthogonal and EdgeLine CoEdge connectors through midboards and subcards. The Impact 100 Ohm direct orthogonal square plug connector and subcard system is designed for direct PCB connections, reducing the performance limitations of backplane and midboard connections. The space-saving Impact technology supports high-speed 25 Gbps data rates and greatly reduces airflow restrictions, crosstalk and capacitance limitations in high-speed channels. The Impact connector also features compatible pin technology and the industry's lowest insertion force.

     The EdgeLine CoEdge connector provides a low-side, high-interconnect solution that creates minimal air resistance in air-cooled enclosures and electrically optimized terminals, minimizing noise from high-speed transmissions exceeding 25Gbps. The all-in-one EdgeLine connector is cost-effective and scalable, allowing designers to prescribe first-mate, last-break signage, and shorter stump lines for high-speed communication using a custom card-edge interface.

     When the signal leaves the daughter card, the zQSFP+ integrated shield and connector transmit it to the zQSFP+ branch cable and into the router/switch. The Molex zQSFP+ interconnect solution supports next-generation 100 Gbps Ethernet and 100 Gbps unlimited bandwidth EDR applications with outstanding thermal cooling, signal integrity, EMI protection, and the industry's lowest optical power consumption, delivering 28 Gbps data rates over distances of up to 4km.

     Once the signal is inside the router, the NeoScale™ 28 Gbps intermediate connector can transmit the signal to the mother board, then onto the backplane to another Impact solution, so that the signal transmission is fast and clean. Molex's recently released NeoScale interlayer connector is one of the highest performing interlayer connectivity products on the market, featuring a unique patent-pending three-way design feature that aggregates signals into an electrically optimized structure.

     The ternary design, based on high-speed differential pairs, high-speed single-ended transmission, low-speed control connections and power requirements, not only gives designers the flexibility to mix and match different ternary configurations, but also optimizes the channels electrically, helping to provide very clean signal channels. The NeoScale connector's PCB connection method comes with Molex award-winning Solder Charge™SMT connection technology and options for crimp mounting. This three-element combination conforms to the image size and provides convenient and flexible PCB routing in one or two layers of PCB, which can minimize the PCB thickness of the design, thereby reducing the PCB cost.