STMicroelectronics expands 3D depth-sensing layout with next-generation time-flight sensors

     STMicroelectronics announced the launch of a versatile, direct Time of Flight (dToF)3D LiDAR(Light Detection and Ranging) module with excellent 2.3k resolution, as well as the first order for an ultra-small 500MP indirect Time of Flight (iToF) sensor.

     Alexandre Balmefrezol, General manager of ST's Imaging Sub-Products division, said: "ToF sensors can accurately measure the distance from the sensor to the object in the scene, inspiring developers to develop exciting and innovative features in smart devices, home appliances and industrial automation equipment. With more than 2 billion sensors shipped, from the simplest single-zone ranging sensors to the latest high-resolution 3D indirect and direct ToF sensors, we continue to expand the layout of ST's unique products. "Our vertically integrated supply chain, from pixel and metasurface lens technology to design and manufacturing, with modular assembly plants around the world, allows us to offer highly innovative, highly integrated, high-performance sensors."

     The VL53L9, announced today, is a new direct ToF 3D LiDAR chip with a resolution of up to 2,300 detection areas. This LiDAR integrated dual-scan floodlight lighting is unique on the market and can detect small objects and edges and capture 2D infrared (IR) images and 3D depth map information. It is a direct-to-use, low-power module with on-chip dToF processing without additional external components or calibration processes. In addition, the chip has a range of between 5 centimeters and 10 meters.

     The features of the VL53L9 enhance the camera's auxiliary focusing performance, supporting macro to telephoto photography, and enabling laser autofocus, defocus and movie effects for still images and 60 frames per second video shooting. Virtual reality (VR) systems utilising accurate depth maps and 2D maps can improve the accuracy of 3D reconstructions, enhancing immersive games and virtual reality experiences such as virtual visits or 3D avatars. In addition, the ability to detect the edges of small objects up close and at a distance makes this sensor suitable for applications such as virtual reality or SLAM (simultaneous location mapping).

     St also announced the VD55H1 ToF sensor, which has begun mass production, and signed the first supply contract with Blue Core Technology, a Chinese company specializing in the development of depth vision systems for mobile robots. Myer Microvision (MRDVS), a subsidiary of Blue Core Technologies, selected the VD55H1 to improve the depth perception accuracy of 3D cameras. This high-performance, small-size camera with built-in ST sensors integrates 3D vision capabilities and edge artificial intelligence to provide intelligent obstacle avoidance and high-precision docking for mobile robots.

     In addition to machine vision, the VD55H1 is ideal for 3D webcams, PC and VR headsets 3D reconstruction, as well as people counting and activity detection in smart homes and buildings. The sensor combines 672 x 804 sensing pixels on a tiny chip and can accurately map a three-dimensional surface by measuring the distance of the sensor to more than 500,000 points. St's backlighting stacked wafer manufacturing process allows the sensor to achieve high resolution, with a smaller chip size and power consumption than comparable iToF sensors on the market, making the sensor ideal for building 3D content for webcams and virtual reality applications, including avatars, hand modeling and games.