The miniature Wi-Fi 6 combo module has an integrated antenna

     Insight SiP announced its ISP5261 Wi-Fi 6 module at Embedded World 2024. The module functions as a fully functional Bluetooth LE and Wi-Fi radio node, capable of operating autonomously on battery power for long periods of time. It could form the core of autonomous iot devices that require Bluetooth LE and Wi-Fi connectivity. The device uses SiP technology to provide the most advanced RF technology integration and miniaturization. It also benefits from the company's proprietary, industry-leading "encapsulated antenna" technology.

     The module is based on the NXP Semiconductor RW612 single chip Wi-Fi/ Bluetooth LE/802.15.4 wireless MCU SoC. It integrates a 32-bit ARM Cortex-M33 CPU running at 260MHz, an additional 4MB QSPI flash memory, 1.2MB SRAM, and analog and digital peripherals. Its powerful processor and ample memory allow the module to be used as the core of complex iot applications.

     Despite its small size, just 12mm x 12mm x 1.8mm, the module integrates decoupling capacitors, 40MHz crystals for Wi-Fi and Bluetooth LE, 32.768kHz crystals for low-power timing, DC-DC converters, RF matching circuits, and dual-band (2.4GHz and 5GHz) antennas. As a result, the module offers class-leading performance and miniaturization.Low power consumption and advanced power management make AA batteries last for months. Wi-fi communication conforms to the wi-fi alliance of wi-fi 6 specification includes: the IEEE 802.11ax /ac/n/a/g/b/e/I/k/v/w.

     Bluetooth LE connection is compatible with Bluetooth 5.4 and supports remote communication. The ISP5261 Bluetooth LE part can be used in either peripheral or central roles and can handle up to 16 central/peripheral connections simultaneously. Material and threading protocols that enable Internet access and support for smart home applications are also supported. The module has outstanding security features, including the ARM TrustZone processor and NXP Edgelock hardware security module, which supports trust roots, secure communication and update verification.

     Nick Wood, Vice President of Marketing at Insight SiP, said: "We are excited to launch this module with next-generation Wi-Fi 6 and BLE technology. Wi-Fi has multiple uses, but the new Wi-Fi 6 is clearly aimed at iot applications and use cases. Customers can trust this Wi-Fi solution with built-in security features."

     Larry Olivas, vice president and general manager of Wireless Connectivity solutions at NXP Semiconductors, said: "Insight SIP's micro-integrated modules will open up new design opportunities for customers in the industrial and iot markets. "Secure connectivity through the most important protocols, including Thread, Wi-Fi, Bluetooth, and Matter, will help simplify design and reduce the complexity of supporting Matter, making it easier and faster to bring new products to market."