接口-專業
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類別半導體 / 接口IC / 接口-專業
記錄 3,987
頁面 63/133
圖片 |
型號 |
制造商 |
描述 |
庫存 |
數量 |
系列 | 應用程序 | 接口 | 電壓-供電 | 包裝/箱 | 供應商設備包裝 | 安裝類型 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
8,352 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,996 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,492 |
|
RBicLite™ | Sensor Signal Conditioner - Resistive | ZACwire™ One-Wire Interface | 2.7V ~ 30V | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
2,610 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, ZACwire™ One-Wire Interface | 4.5V ~ 5.5V | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
7,938 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, ZACwire™ One-Wire Interface | 4.5V ~ 5.5V | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | Surface Mount |
|
|
|
NXP |
IC SYSTEM BASIS W/CAN 28SOIC |
3,474 |
|
- | System Basis Chip | CAN | 5V | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
5,922 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, ZACwire™ One-Wire Interface | 4.5V ~ 5.5V | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
7,506 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, ZACwire™ One-Wire Interface | 4.5V ~ 5.5V | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
5,364 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
3,438 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
5,094 |
|
* | - | - | - | 14-SSOP (0.209", 5.30mm Width) | 14-SSOP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,114 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, SPI, ZACwire™ | 2.7V ~ 5.5V | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
5,436 |
|
- | System Basis Chip | CAN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
5,400 |
|
- | System Basis Chip | CAN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
5,562 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
4,536 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
4,896 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
8,928 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
IC SYSTEM BASE W/CAN 28SOIC |
8,028 |
|
- | Automotive | SPI Serial | 5.5V ~ 18V | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
7,362 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
SYSTEM BASIS CHIP LIN 2X 3.3 V |
2,394 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIPLIN 2X 5.0 V/ |
8,460 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
8,982 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,996 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
SYSTEM BASIS CHIP LIN 2X 3.3 V |
5,544 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP LIN 2X 5.0 V |
3,598 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
7,092 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, ZACwire™ One-Wire Interface | 4.5V ~ 5.5V | 14-SSOP (0.209", 5.30mm Width) | 14-SSOP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,600 |
|
RBicLite™ | Sensor Signal Conditioner - Resistive | ZACwire™ One-Wire Interface | 2.7V ~ 30V | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
4,356 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
SYSTEM BASIS CHIP 2 LIN 2X 3.3 |
6,930 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |