Technology Articles

2015-06 Passive Components Vishay

[六月 22 2015] Vishay Intertechnology has announced the introduction of a new series of high voltage thin film flat sheet resistors, TNPV e3, with operating voltages up to 1000V, providing the industry's first VCR of less than 1ppm/V, strict tolerances of ±0.1%, and TCR of as low as ±10ppm/K. The operating voltage of approximately dimensional thin-film resistors is generally 200V, and the Vishay Draloric TNPV e ...

2015-06 Passive Components Infineon Technologies

[六月 21 2015] Infineon Technologies Bipolar Ltd. further expands its bipolar semiconductor product lineup with the introduction of phototouch thyristors that enhance system reliability, reduce system costs and simplify the design of ultra-high power applications. Infineon's new 6-inch thyristors are equipped with a reliable optical trigger component that eliminates the need for an external electrical trigger c ...

2015-06 Connectors STMicroelectronics

[六月 21 2015] STMicroelectronics introduces the new STNRG family of digital controllers to help designers maximize the benefits of digital power conversion technology, including high energy efficiency at full load, enhanced security, rich diagnostic capabilities, and easy networking. The high durability of the new products is sufficient to meet the needs of high-end industrial applications as well as a variety ...

2015-06 Connectors Silicon Motion, Inc.

[六月 20 2015] Silicon Motion Technology Corporation announced that its SM2256 SATA (6Gb/s) client SSD controller now supports Micron's new 16nm 128Gb TLC NAND flash memory. Help achieve superior performance and unmatched reliability, resulting in the next generation of cost-effective TLC SSD products. The SM2256 is the world's first SSD controller to support Micron 16nm TLC NAND and the best-performing, cost-o ...

2015-06 Connectors Microchip Technology

[六月 20 2015] Micron Technology, Inc. has announced the addition of a new member to its extensive portfolio of flash memory products - tailored solutions for extremely cost-conscious consumer applications seeking high performance and reliability. The new TLC NAND is based on a 16-nanometer (nm) process that provides the ideal balance of functionality for applications such as USB sticks and consumer SSDS. TLC d ...

2015-06 Connectors Diodes Incorporated

[六月 19 2015] Diodes Inc. introduced the PAM8905, a 1.9W Class D audio amplifier for smartphones powered by single-cell lithium-ion batteries, suitable for audio systems that provide high voltage level horizontal output at low supply voltage. The new product generates the voltage rail of the output stage through the built-in boost converter, and at the same time, the battery tracking automatic gain control fun ...

2015-06 Passive Components Vishay

[六月 19 2015] Vishay Intertechnology announced the launch of 28 new 600V and 650V FRED Pt Gen 4 Ultrafast fast recovery diodes for high frequency converters in power modules, motor drives, UPS, solar inverters and welder inverters. The "H" and "U" series of devices from Vishay Semiconductors, available in bare crystal form in wafers, have ultra-low forward voltage and reverse recovery charge to reduce losses a ...

2015-06 Power Qualcomm

[六月 18 2015] Qualcomm Inc. announced that its subsidiary, Qualcomm Innovations, has introduced the industry's first hybrid wireless range extender and 802.11ac standard Wi-Fi technology using Qualcomm Atheros' HomePlug leading AV2 (HPAV2) Multiple input/Multiple Output (MIMO) powerline. The company also announced a new HomePlug AV2 Single input/Single Output (SISO) solution to enable reliability for mainstrea ...

2015-06 Power Maxwell Technologies

[六月 18 2015] Marvell announced the Avastar 88W8997. The product is the industry's smallest and most energy-efficient MU-MIMO wireless interconnect combo chip for both enterprise and consumer markets. The 88W8997 is the industry's first 28nm 2 x 2 802.11ac Wave-2 combo chip with full support for Bluetooth 4.2 and future Bluetooth 5.0. Philip Poulidis, vice president, general manager of Marvell's Wireless and I ...

2015-06 Connectors Molex

[六月 17 2015] Molex Corporation announces Brad Micro-Push M12 connectors for factory automation and industrial lighting applications. The connector is equipped with an innovative push-in and push-out interface, which reduces installation time by up to 80% compared to screw connectors, and allows convenient blind insertion connections in limited Spaces. The solution is constructed without any metal components t ...

2015-06 Connectors Dialog Semiconductor GmbH

[六月 17 2015] Dialog Semiconductor Corporation announced the launch of two power control ics, the iW1818 and iW1830, which not only significantly improve the reliability of white goods power systems, but also reduce material (BOM) costs. These two digital power control ics can be used in dishwashers, refrigerators, stoves, microwave ovens, and other high-volume home appliance systems. The white goods market is ...

2015-06 Power Broadcom

[六月 16 2015] Broadcom announced the launch of a new Bluetooth Smart system-on-a-chip (SoC) product, adding to its Wireless Internet Connectivity for Embedded Devices (WICED™) portfolio. Broadcom's WICED Smart Ready SoC doubles speed over Bluetooth Smart connections, dramatically improving performance and extending the battery life of Internet of Things (IoT) devices. By integrating Bluetooth and Bluetooth Sma ...