Winbond Electronics 內存
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類別半導體 / 內存IC / 內存
制造商Winbond Electronics
記錄 1,359
頁面 29/46
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型號 |
制造商 |
描述 |
庫存 |
數量 |
系列 | 內存類型 | 內存格式 | 技術 | 內存大小 | 內存接口 | 時鐘頻率 | 寫周期-字，頁 | 訪問時間 | 電壓-供電 | 工作溫度 | 安裝類型 | 包裝/箱 | 供應商設備包裝 |
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Winbond Electronics |
IC FLASH 16M SPI 104MHZ 8SOIC |
24,452 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 3ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 24TFBGA |
8,604 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 50µs, 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 24TFBGA |
7,452 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 50µs, 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
6,246 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 50µs, 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
2,538 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 50µs, 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 16SOIC |
5,652 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 60µs, 5ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
2,844 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 60µs, 5ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Winbond Electronics |
IC FLASH 4M SPI 80MHZ 8VSOP |
5,670 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 4Mb (512K x 8) | SPI | 80MHz | 800µs | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-VSOP |
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Winbond Electronics |
IC FLASH 8M SPI 80MHZ 8VSOP |
2,808 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 80MHz | 800µs | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-VSOP |
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Winbond Electronics |
IC DRAM 256M PARALLEL 168WFBGA |
3,996 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mb (8M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 256M PARALLEL 168WFBGA |
6,480 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mb (8M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 256M PARALLEL 168WFBGA |
7,326 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mb (16M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 256M PARALLEL 168WFBGA |
5,004 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mb (16M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 168WFBGA |
4,896 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 168WFBGA |
5,922 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 134VFBGA |
7,200 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 134VFBGA |
2,178 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 168WFBGA |
5,742 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 168WFBGA |
5,364 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 134VFBGA |
5,058 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 134VFBGA |
3,042 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
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Winbond Electronics |
IC FLASH 128M PARALLEL 56TFBGA |
5,256 |
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- | Non-Volatile | FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA | 56-TFBGA (7x9) |
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Winbond Electronics |
IC FLASH 128M PARALLEL 56TFBGA |
4,212 |
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- | Non-Volatile | FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA | 56-TFBGA (7x9) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 64LFBGA |
7,434 |
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- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (32M x 8, 16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LFBGA (11x13) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 64LFBGA |
2,052 |
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- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (32M x 8, 16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LFBGA (11x13) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 64LFBGA |
7,380 |
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- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LFBGA (11x13) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 56TFBGA |
3,436 |
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- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA | 56-TFBGA (7x9) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 64LFBGA |
6,642 |
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- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LFBGA (11x13) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 56TFBGA |
3,492 |
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- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA | 56-TFBGA (7x9) |
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Winbond Electronics |
IC DRAM 1G PARALLEL 96WBGA |
6,624 |
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- | Volatile | DRAM | SDRAM - DDR3 | 1Gb (64M x 16) | Parallel | 800MHz | - | 20ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-WBGA (9x13) |