NXP 微控制器
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類別半導體 / 嵌入式處理器和控制器 / 微控制器
制造商NXP USA Inc.
記錄 7,759
頁面 211/259
圖片 |
型號 |
制造商 |
描述 |
庫存 |
數量 |
系列 | 核心處理器 | 核心大小 | 速度 | 連接性 | 外圍設備 | I / O數量 | 程序存儲器大小 | 程序存儲器類型 | EEPROM大小 | RAM大小 | 電壓-電源（Vcc / Vdd） | 數據轉換器 | 振蕩器類型 | 工作溫度 | 安裝類型 | 包裝/箱 | 供應商設備包裝 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
IC MCU 32BIT ROMLESS 160QFP |
8,928 |
|
M683xx | CPU32 | 32-Bit | 20MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75V ~ 5.25V | A/D 16x10b | External | -40°C ~ 105°C (TA) | Surface Mount | 160-BQFP | 160-QFP (28x28) |
|
|
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NXP |
IC MCU 32BIT ROMLESS 160QFP |
6,120 |
|
M683xx | CPU32 | 32-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75V ~ 5.25V | A/D 16x10b | External | -40°C ~ 105°C (TA) | Surface Mount | 160-BQFP | 160-QFP (28x28) |
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|
|
NXP |
IC MCU 32BIT ROMLESS 160QFP |
419 |
|
M683xx | CPU32 | 32-Bit | 20MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75V ~ 5.25V | A/D 16x10b | External | -40°C ~ 85°C (TA) | Surface Mount | 160-BQFP | 160-QFP (28x28) |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 160QFP |
6,714 |
|
M683xx | CPU32 | 32-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75V ~ 5.25V | A/D 16x10b | External | -40°C ~ 85°C (TA) | Surface Mount | 160-BQFP | 160-QFP (28x28) |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 160QFP |
2,088 |
|
M683xx | CPU32 | 32-Bit | 20MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75V ~ 5.25V | A/D 16x10b | External | -40°C ~ 125°C (TA) | Surface Mount | 160-BQFP | 160-QFP (28x28) |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 160QFP |
8,316 |
|
M683xx | CPU32 | 32-Bit | 20MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75V ~ 5.25V | A/D 16x10b | External | -40°C ~ 105°C (TA) | Surface Mount | 160-BQFP | 160-QFP (28x28) |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 160QFP |
6,660 |
|
M683xx | CPU32 | 32-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75V ~ 5.25V | A/D 16x10b | External | -40°C ~ 105°C (TA) | Surface Mount | 160-BQFP | 160-QFP (28x28) |
|
|
|
NXP |
IC MCU 8BIT 16KB FLASH 32LQFP |
7,650 |
|
HC08 | HC08 | 8-Bit | 8MHz | LINbus, SCI, SPI | LVD, POR, PWM | 21 | 16KB (16K x 8) | FLASH | - | 1K x 8 | 3V ~ 5.5V | A/D 8x10b | Internal | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC MCU 8BIT 8KB FLASH 32LQFP |
7,272 |
|
HC08 | HC08 | 8-Bit | 8MHz | CANbus, LINbus, SCI, SPI | LVD, POR, PWM | 21 | 8KB (8K x 8) | FLASH | - | 1K x 8 | 3V ~ 5.5V | A/D 8x10b | Internal | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC MCU 8BIT ROMLESS 52PLCC |
6,768 |
|
HC11 | HC11 | 8-Bit | 3MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | - | 256 x 8 | 4.5V ~ 5.5V | A/D 8x8b | External | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
|
NXP |
IC MCU 8BIT ROMLESS 52PLCC |
706 |
|
HC11 | HC11 | 8-Bit | 3MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | 512 x 8 | 256 x 8 | 4.5V ~ 5.5V | A/D 8x8b | External | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
|
NXP |
IC MCU 8BIT ROMLESS 44PLCC |
8,478 |
|
HC11 | HC11 | 8-Bit | 3MHz | SCI, SPI | POR, WDT | 26 | - | ROMless | - | 192 x 8 | 4.5V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
|
|
|
NXP |
IC MCU 8BIT 16KB OTP 44PLCC |
2,340 |
|
HC05 | HC05 | 8-Bit | 2.1MHz | SCI, SPI | POR, WDT | 24 | 16KB (16K x 8) | OTP | - | 352 x 8 | 3V ~ 5.5V | - | Internal | -40°C ~ 105°C (TA) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
|
|
|
NXP |
IC MCU 8BIT 4KB OTP 44PLCC |
8,369 |
|
HC11 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 26 | 4KB (4K x 8) | OTP | - | 192 x 8 | 4.5V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
|
|
|
NXP |
IC MCU 8BIT 4KB OTP 44PLCC |
336 |
|
HC11 | HC11 | 8-Bit | 3MHz | SCI, SPI | POR, WDT | 26 | 4KB (4K x 8) | OTP | - | 192 x 8 | 4.5V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
|
|
|
NXP |
IC MCU 8BIT 12KB OTP 52PLCC |
7,023 |
|
HC11 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | 12KB (12K x 8) | OTP | 512 x 8 | 512 x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
|
NXP |
IC MCU 8BIT 12KB OTP 52PLCC |
2,036 |
|
HC11 | HC11 | 8-Bit | 3MHz | SCI, SPI | POR, WDT | 38 | 12KB (12K x 8) | OTP | 512 x 8 | 512 x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
|
NXP |
IC MCU 8BIT 12KB OTP 52PLCC |
3,834 |
|
HC11 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | 12KB (12K x 8) | OTP | 512 x 8 | 512 x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | -40°C ~ 125°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
|
NXP |
IC MCU 8BIT 12KB OTP 52PLCC |
2,988 |
|
HC11 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | 12KB (12K x 8) | OTP | 512 x 8 | 512 x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | -40°C ~ 105°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
|
NXP |
IC MCU 8BIT 1.2KB OTP 20DIP |
7,830 |
|
HC05 | HC05 | 8-Bit | 4MHz | - | POR, WDT | 14 | 1.2KB (1.2K x 8) | OTP | - | 64 x 8 | 3V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
|
|
|
NXP |
IC MCU 8BIT 1.2KB OTP 20DIP |
6,678 |
|
HC05 | HC05 | 8-Bit | 4MHz | - | POR, WDT | 14 | 1.2KB (1.2K x 8) | OTP | - | 64 x 8 | 3V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
|
|
|
NXP |
IC MCU 8BIT ROMLESS 44QFP |
4,986 |
|
HC11 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 26 | - | ROMless | - | 192 x 8 | 3V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | Surface Mount | 44-QFP | 44-QFP (10x10) |
|
|
|
NXP |
IC MCU 8BIT ROMLESS 44PLCC |
8,568 |
|
HC11 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 26 | - | ROMless | - | 192 x 8 | 3V ~ 5.5V | - | Internal | 0°C ~ 70°C (TA) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
|
|
|
NXP |
IC MCU 8BIT ROMLESS 52PLCC |
7,110 |
|
HC11 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | - | 512 x 8 | 3V ~ 5.5V | A/D 8x8b | Internal | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
|
NXP |
IC MCU 8BIT ROMLESS 52PLCC |
2,736 |
|
HC11 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | 512 x 8 | 512 x 8 | 3V ~ 5.5V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
|
NXP |
IC MCU 8BIT ROMLESS 52PLCC |
8,334 |
|
HC11 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | 512 x 8 | 512 x 8 | 3V ~ 5.5V | A/D 8x8b | Internal | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
|
|
|
NXP |
IC MCU 8BIT 1.2KB OTP 20SOIC |
7,271 |
|
HC05 | HC05 | 8-Bit | 4MHz | - | POR, WDT | 14 | 1.2KB (1.2K x 8) | OTP | - | 64 x 8 | 3V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
|
NXP |
IC MCU 8BIT 6KB OTP 28DIP |
1,337 |
|
HC05 | HC05 | 8-Bit | 2.1MHz | SIO | POR, Temp Sensor, WDT | 22 | 6KB (6K x 8) | OTP | - | 224 x 8 | 2.7V ~ 5.5V | A/D 4x12b | Internal | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
|
|
|
NXP |
IC MCU 8BIT 32KB OTP 64QFP |
8,406 |
|
HC05 | HC05 | 8-Bit | 4MHz | CANbus, SCI | POR, WDT | 24 | 32KB (32K x 8) | OTP | 256 x 8 | 528 x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | 64-QFP (14x14) |
|
|
|
NXP |
IC MCU 8BIT 24KB OTP 80QFP |
5,382 |
|
HC11 | HC11 | 8-Bit | 3MHz | SCI, SPI | POR, PWM, WDT | 62 | 24KB (24K x 8) | OTP | 640 x 8 | 768 x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | 80-QFP (14x14) |