接口-電信
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類別半導體 / 接口IC / 接口-電信
記錄 3,109
頁面 36/104
圖片 |
型號 |
制造商 |
描述 |
庫存 |
數量 |
系列 | 功能 | 接口 | 電路數 | 電壓-供電 | 電流-電源 | 功率（瓦） | 工作溫度 | 安裝類型 | 包裝/箱 | 供應商設備包裝 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
8 CHANNEL 10/100 OR 1XGE ETHERNE |
5,094 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
16GE + 10GE SWITCH |
3,454 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC CESOP PROCESSOR 552BGA |
2,358 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
|
|
Microchip Technology |
ARROW M8XFE |
4,500 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
24FE + 2X2.5GE + 2X10G |
6,084 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
8 CHANNEL FAST ETHERNET OVER SON |
3,276 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
ARROW 8XFE PB FREE |
8,136 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
522 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F |
5,256 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
TEMAP 84FDL, LF BUMP |
4,086 |
|
- | Framer | E1, T1 | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
8GE + 2XHG SWITCH |
5,202 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
GIGABIT ETH SWITCH 24GE 4XHG |
7,140 |
|
- | Switch | PCI Express | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
8GE X 2.5GE + 2XHG SWITCH |
8,820 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
24GE + 4X2.5G 10GE SWITCH |
8,334 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC CESOP PROC 1024CH 552BGA |
4,183 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
|
|
Microchip Technology |
TEMUX-84 WITH E3 MAPPERS, DS3/E3 |
3,132 |
|
- | Framer | E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
|
|
|
Microchip Technology |
TEMUX-84 WITH E3 MAPPERS, DS3/E3 |
6,012 |
|
- | Framer | E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
|
|
|
Broadcom |
24GE + 4X10GE SWITCH |
3,780 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
24GE + 4X10GE SWITCH |
6,426 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
ARROW 2XGE PB FREE |
4,644 |
|
- | Ethernet, SONET/SDH | GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
|
|
|
Microchip Technology |
ARROW 2XGE PB FREE |
8,406 |
|
- | Ethernet, SONET/SDH | GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
|
|
|
Microchip Technology |
ARROW 2XGE |
4,392 |
|
- | Ethernet, SONET/SDH | GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
|
|
|
Microchip Technology |
84/63 CHANNEL T1/E1 FRAMER DEVIC |
5,706 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
84/63 CHANNEL T1/E1 FRAMER DEVIC |
7 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
MaxLinear, Inc. |
IC LIU LH/SH T1/E1 SGL 64TQFP |
4,608 |
|
- | Line Interface Unit (LIU) | LIU | 1 | 3.135V ~ 3.465V | - | - | - | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
|
|
|
MaxLinear, Inc. |
IC LIU LH/SH T1/E1 SGL 64TQFP |
8,820 |
|
- | Transceiver | - | 1 | 3.135V ~ 3.465V | - | - | - | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
|
|
|
Broadcom |
24GE + 4X1G/2.5G SWITCH |
2,484 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
24GE + 4X10GE SWITCH |
7,272 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
ARROW 24XFE |
8,748 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
24GE + 4X10GE SWITCH |
2,304 |
|
* | - | - | - | - | - | - | - | - | - | - |