Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
數百萬庫存的電子零件。 接受缺貨訂單。 24小時內的價格和交貨時間報價。

Technology Articles

記錄 2,852
頁面 134/238
Article Cover

Ams introduces a new automotive-grade magnetic position sensor with a PSI5 interface

2017-10 Sensors ams
[十月 11 2017] Ams has announced the introduction of the AS5172AVB magnetic position sensor with a two-wire PSI5 interface for fast and secure transmission of precise rotating position measurement data. The new AS5172A and AS5172B system-on-chip (SoC) are 360-degree non-contact rotating magnetic position sensors that provide 14-bit high-resolution absolute Angle measurement. The sensors were developed as SEooC ...
Article Cover

ON Semiconductor low-light imaging SoC for automotive camera applications

2017-10 Semiconductors ON Semiconductor
[十月 10 2017] ON Semiconductor, driving energy efficient innovation, has introduced two new highly integrated 1 megapixel (Mp)CMOS image sensing products, advancing the company's significant advances in the fast-growing automotive imaging field. The complete solution offered by the new device integrates image sensors and processing functions in a low-power system-on-a-chip (SoC) to simplify and accelerate adop ...
Article Cover

Intersil introduces the industry's first USB-C buck boost regulator

2017-10 Sensors Renesas Electronics America
[十月 9 2017] Intersil, a subsidiary of Renesas Electronics, announced the ISL95338, the industry's first step-boost regulator for tablets, ultrabooks, mobile power supplies and other mobile devices using a reversible USBType-C4 connector. The new bidirectional regulator accepts a wide range of DC power inputs, including AC/DC power adapters, USB PD3.0 ports, travel power adapters, mobile power supplies, and m ...
Article Cover

STMicroelectronics works with Objenious to accelerate the connection of loT nodes to the oRa network

2017-10 Semiconductors STMicroelectronics
[十月 8 2017] STMicroelectronics, a leading global semiconductor supplier across multiple electronic applications and a member of the LoRaAlliance, and Objenious, a founding member of the LoRaAlliance and the first French telecom operator to offer LoRa network services nationwide, announced a technical collaboration. Accelerate the connection of iot (loT) nodes to the LoRa network. The ST Development Kit, cert ...
Article Cover

ST Power Line communication chipset solutions drive power infrastructure reform

2017-10 Semiconductors STMicroelectronics
[十月 7 2017] STMicroelectronics drives the global wave of intelligent power use and management with the introduction of a new modular Powerline Communications (PLC) modem chipset. The new chipset is ready standby manufacturers can flexibly design electricity meters, smart grid node street lights, home controllers, industrial controllers, and this new product is currently used by three smart meter manufacturer ...
Article Cover

Infineon introduces the sixth generation 650 V CoolSiC Schottky diode

2017-10 Passive Components Infineon Technologies
[十月 6 2017] Infineon Technologies AG introduces the sixth generation 650 V CoolSiCTM Schottky diode, the latest addition to the CoolSiC diode product family. It builds on the distinctive characteristics of fifth-generation products to ensure reliability, quality and efficiency. The CoolSiC G6 diode is the perfect complement to the 600 V and 650 V CoolMOSTM 7 product family. They target current and future ser ...
Article Cover

Vishay uses the new TMBS rectifier in the SlimDPAK package to save space

2017-10 Connectors Vishay
[十月 5 2017] Vishay Intertechnology has announced the launch of a new series of surface mount TMBS Trench MOS Barrier Schottky rectifiers in the SlimDPAK(TO-252AE) package from the eSMP family. Vishay General Semiconductor rectifiers are thinner than other DPAK(TO-252AA) packaged devices, and have better heat dissipation, reverse voltages from 45V TO 150V, lower forward conduction voltages, and higher current ...
Article Cover

KEMET introduces the KPS-MCC C0G High temperature 200°C large capacitor solution

2017-10 Semiconductors KEMET
[十月 4 2017] KEMET, the world's leading supplier of electronic components, has announced the launch of its KPS MCC C0G high temperature 200°C large capacitor solution for harsh environment applications. Developed by combining Kimi Electronics' patented stable C0G/NPO base metal electrode (BME) dielectric system with durable lead | wire frame technology, these capacitors are ideally suited for high temperature ...
Article Cover

STMicroelectronics SDK accelerates the introduction of smart connected lighting and automation products

2017-10 Semiconductors STMicroelectronics
[十月 4 2017] STMicroelectronics, the world's leading semiconductor supplier across multiple electronic applications, has released a new Bluetooth software development tool that enables developers to use the latest Bluetooth wireless networking technology to develop smart connected products and drive innovation in the next generation of mobile phone-controlled products. The Bluetooth Technology Alliance (SIG) ...
Article Cover

ON Semiconductor launches the world's most compact Sigfox certified solution

2017-10 Semiconductors ON Semiconductor
[十月 3 2017] Driving energy efficient innovation, ON Semiconductor introduces a new programmable RF transceiver System-on-chip package (SiP) that integrates an advanced RF system single-chip (SOC) with all surrounding bill of materials, including a thermocooled crystal oscillator TCXO. AX-SIP-SFEU offers the most integrated Sigfox solution for both upstream (send) and downstream (receive) communications. This ...
Article Cover

Littelfuse SPA diodes protect 28nm chipsets from ESD damage

2017-10 Passive Components Littelfuse
[十月 3 2017] Littelfuse announced the launch of the 0.9pF +30kV distributed unidirectional Transient Suppression Diode Array (SPA@ diode) family. The SP3222 series transient suppression diode array combines a low capacitance rail to rail diode with an additional Zener diode diode to protect electronic devices from destructive electrostatic discharge (ESD). This powerful - electrode is AEC-Q101 compliant and s ...
Article Cover

Microchip power monitoring ics increase the power measurement accuracy of Win10 software to 99%

2017-10 Semiconductors Microchip Technology
[十月 2 2017] Microchip Technology announced the launch of PAC1934, a high-precision power and energy monitoring chip that is fully compatible with the Energy Estimation Engine (E3) built into the Windows 10 operating system. On battery-powered Windows10 devices, the measurement accuracy is up to 99%. Microchip's PAC 1934 and Windows 10 drivers, combined with Microsoft's E3 service, improved battery usage meas ...