Technology Articles

2015-01 Passive Components STMicroelectronics

[一月 6 2015] ST Launches New Automotive Quality grade Silicon Carbide (SiC) diodes, To meet the stringent requirements of new energy vehicles such as electric vehicles and Plug-in Hybrids (PHEV, plug-in Hybrids) for on-board battery chargers (OBC, on-board battery chargers) to handle high power in a limited space. These diodes allow designers to develop smaller power modules, which are not only beneficial for ...

2015-01 Power Microchip Technology

[一月 5 2015] Microchip announced the launch of its fourth generation JukeBlox platform, which enables audio brands to develop high-quality, low-latency products such as single or multi-room wireless speakers, AV receivers, small and micro systems, and bar speakers. To enhance the consumer listening experience, Microchip's new JukeBlox 4 software development Kit (SDK) is equipped with CY920 Wi-Fi and Bluetooth ...

2015-01 Connectors Vishay

[一月 5 2015] Vishay introduces a new family of VRPower integrated DrMOS power level solutions in three PowerPAK package sizes to address design challenges in high-power and high-performance polyphase POL applications. Vishay Siliconix SiC789 and SiC788 are available in MLP66-40L packaging and space occupancy according to the Intel 4.0 DrMOS standard (6mm x 6mm); The SiC620 and SiC620R come in a new 5mm x 5mm ...

2015-01 Power Silicon Labs

[一月 4 2015] Silicon Labs has announced a new generation of digital TV demodulators that support the latest satellite, terrestrial and cable standards. The new Si218x family includes the world's first demodulator to support the latest DVB-S2X specification, which provides the latest features and improved performance on top of the DVB-S2 standard. The series also expands Silicon Labs' industry-leading line of ...

2015-01 Power Maxwell Technologies

[一月 4 2015] Marvell has announced the Marvell Alaska C 88X5111, a fully integrated 100GbE Gearbox offering multi-link Gearbox (MLG) functionality. The device enables 100Gbps full-duplex transmission, performing all the physical layer functions required for a variety of media, including single-mode and multimode fiber modules, backplanes, and passive and active direct copper cables. The 88X5111 line side inte ...

2015-01 Connectors NXP

[一月 4 2015] NXP Semiconductors introduces the LPC54100 series of microcontrollers, a major advance in sensor-based products and a major breakthrough in ultra-low power "always on" sensor processing. Using a market-proven, innovative, patented architecture, the series achieves unmatched energy efficiency, reducing energy consumption by an average of 20% compared to the closest competing products. The LPC54100 ...

2015-01 Semiconductors NXP

[一月 3 2015] NXP Semiconductors has introduced the TFA9897, a third-generation smart amplifier for smartphone audio systems. As the world's smallest smart amplifier solution, the TFA9897 will bring industry-leading speaker protection to all mobile phones at an affordable price. The launch of this product further demonstrates NXP's commitment to developing usable innovative solutions for the rapidly growing po ...

2015-01 Connectors STMicroelectronics

[一月 3 2015] ST introduces the advanced single-channel gate driver chip STGAP1S. The new product integrates galvanic isolation and analog and logic circuitry on the same chip, helping designers simplify driver design. At the same time, ensure that the product has excellent noise immunity, and achieve safe and reliable power control effect. The STGAP1S is the first of ST's new generation of gapDRIVE™ gate driv ...

2015-01 Semiconductors Renesas Electronics America

[一月 3 2015] Renesas Electronics, a leading provider of advanced semiconductor solutions, announced its successful on-chip development of a new dual-port static random access memory (SRAM) in-vehicle infotainment system-on-chip (SoC) of 16 nanometers (nm) and posterity. The new SRAM is optimized for use as an automotive infotainment system chip in the video buffer memory to enable real-time image processing c ...

2015-01 Connectors Silicon Labs

[一月 2 2015] Silicon Labs announced the introduction of PCI Express (PCIe) Gen1/2 2/3 fan-out buffers, designed for data center applications including servers, storage, and switches. For today's leading x86 motherboards and server systems, the new Si5310x/11x/019 PCIe buffer is the industry's most energy-efficient fan-out buffer, effectively expanding Silicon Labs' growing PCIe timing product line. With flexi ...

2015-01 Connectors United Chemi-Con

[一月 2 2015] Swiss company u‑blox, a global leader in cellular and positioning modules and integrated chips for the automotive, industrial and consumer markets, has announced the launch of NEO-M8T and LEA-M8T Timing modules. These two compact surface-mount modules produce precision reference clocks with an accuracy of less than 20 nanoseconds (20 ns). The receiver has a high sensitivity (with auxiliary GNSS t ...

2015-01 Power Qualcomm

[一月 1 2015] Qualcomm Incorporated announced that its subsidiary, Qualcomm Innovations, will ease data congestion in enterprise networks with a feature-rich, high-performance enterprise connectivity platform. In order to cope with the rapid increase of terminals and large amounts of data traffic in enterprise networks, Qualcomm has introduced corresponding solutions. The solution not only enables sophisticate ...