Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
數百萬庫存的電子零件。 接受缺貨訂單。 24小時內的價格和交貨時間報價。

Technology Articles

記錄 3,061
頁面 220/256
Article Cover

Synaptics introduces the industry's first UHD-enabled display product

2015-07 Power Synapse Wireless
[七月 14 2015] Synaptics, Inc., a leading developer of human-computer interaction solutions, announced the launch of four new display driver integrated circuit (DDIC) solutions, including the industry's first to support Ultra-high definition (UHD) resolution. These feature-rich latest products were developed at the Synaptics Design Center in Japan and enhance Synaptics' industry-leading DDIC product lineup, whi ...
Article Cover

International Rectifier USA, a division of Infineon Technologies, announced the launch of the HiRel HTB28 series

2015-07 Semiconductors Infineon Technologies
[七月 13 2015] IR HiRel, a Us-Based international rectifier company owned by Infineon Technologies, announced the introduction of the HiRel HTB28 series - the industry's first thick-film DC-DC power supply rated at 185 ºC in a 1-inch wide, airtight package. This new equipment is specifically designed for downhole tools for oil and gas exploration and can withstand the high temperature and high impact environmen ...
Article Cover

Vishay introduces the high-performance RCP series of thick film resistors for high power surface mount RF applications

2015-07 Passive Components Vishay
[七月 12 2015] Vishay Intertechnology has announced the availability of the RCP series of thick film resistors for high power surface mount RF applications in 0505, 0603 and 2512 form factors. Vishay Dale devices have very high thermal conductivity and power levels up to 22W with active temperature control. The RCP series resistors use a stable thick film resistance core on an aluminum nitride (AIN) substrate, ...
Article Cover

Molex expands SlimStack small pitch board-to-board connector product line

2015-07 Connectors Molex
[七月 11 2015] Molex Corporation has released two new versions of the SlimStack small pitch SMT board-to-board connector. The SlimStack Hybrid Power SMT board-to-board Connector and the SlimStack Armor™ SMT board-to-board connector integrate more power cords into the signal connector. Designed for use in smartphones, portable audio players, and mobile medical devices, the Molex SlimStack connector portfolio off ...
Article Cover

Best-in-class BSI technology for automotive ADAS and view cameras

2015-07 Semiconductors ON Semiconductor
[七月 10 2015] ON Semiconductor is expanding its highly rated 1/3-inch 1 megapixel (MP) image sensor product lineup with early samples of the company's first backlighting (BSI) sensor technology for the automotive imaging market. Compared to the current market-leading AR0132AT CMOS image sensor for advanced driver assistance systems (ADAS), the innovative new BSI sensor technology offers four times better low-l ...
Article Cover

Gigaphoton launches new laser monitoring solution

2015-07 Semiconductors GigaDevice Semiconductor (HK) Limited
[七月 9 2015] Gigaphoton, Inc., a leading manufacturer of lithography light sources, has announced the launch of a new remote laser monitoring solution for cloud computing redemption for excimer lasers used in semiconductor manufacturing. The Redemption Cloud is a highly scalable and customizable solution based on the latest Web technologies - providing an open platform for innovation, enabling external partne ...
Article Cover

Xsens launches full-featured, low-cost micro motion tracking module

2015-07 Semiconductors XSens Technologies BV
[七月 8 2015] Xsens has released a complete new range of industrial and "production-consumer" applications, with its own 3D IMU/VRU/AHRS motion tracking modules extending its portfolio of successful 4th generation MTi. The new MTi 1 Series motion tracker is offered at a low cost while integrating the latest advanced sensor fusion and micro MEMS technology. Calibrated and tested to allow for minimal implementat ...
Article Cover

Vishay introduces ultra-small form factor ceramic safety gauge Y1 capacitors with high reliability

2015-07 Passive Components Vishay
[七月 7 2015] Vishay Intertechnology has announced the launch of a new series of Compact, pulse-resistant 10kV safety VY1 Compact. Vishay BCcomponents VY1 Compact series devices with diameters as small as 7.5mm for X1(760VAC) and Y1(500VAC) meet IEC 60384-14.3 3rd Edition requirements. Vishay's series of devices uses Y5U ceramic media for RFI and AC line filtering applications in power supplies, smart meters, ...
Article Cover

Lem introduces the new IT xx5 series with ultra-high precision and wide temperature range

2015-07 Semiconductors LEM
[七月 6 2015] Lem has expanded its range of high-precision current sensors with the announcement of A new series of IT xx5 sensors for non-intrusive isolated access measurement of DC, AC and pulse currents with current ratings from 60 A to 600 A. The new series includes four new models: IT 65-S, IT 205-S, IT 405-S and IT 605-S. Compared to previous IT models, the new series extends the operating temperature fr ...
Article Cover

Vishay continues to expand its range of high-performance surface mount polymer tantalum capacitors

2015-07 Passive Components Vishay
[七月 5 2015] Vishay Intertechnology, Inc. (NYSE: VSH announced the continued expansion of its vPolyTan™ T55 family of surface-mount polymer tantalum capacitors with the introduction of A, B, and T(with a maximum height of 1.2mm for low-height B shapes) in eight new performance specifications. The Vishay Polytech T55 series leverages Vishay's leading packaging technology and recent investments in tantalum poly ...
Article Cover

X-FAB launches 180nm SOI foundry technology for automotive applications

2015-07 Power ZF Electronics
[七月 4 2015] X-FAB's chip foundry AG - Analog/mixed Signal and Micro-electro-mechanical Systems (MEMS) foundry - has announced what it claims is the first cost-effective 180-nanometer silicon insulator (SOI) technology for automotive and industrial applications that need to operate in harsh environments. X-FAB says its new kit 40V and 60V high-voltage devices for its XT018 180-nm SOI platform outperform batch ...
Article Cover

Samsung Electronics introduced the 2TB 850 PRO and 850 EVO solid-state drives

2015-07 Semiconductors Samsung
[七月 3 2015] Samsung Electronics announced the launch of the 2 terabyte (TB) 850 PRO and 850 EVO solid-state drive (SSD). Based on the retail SSD lineup, Samsung's 3D Vertical NAND (V-NAND) now features 20 different products with a wide range of 120 gigabytes (GB) to 2TB capacity options. Available in 50 countries, the launch of 2TB drives addresses the growing consumer demand for high-performance and high-ca ...