Technology Articles

2015-05 Optoelectronics NXP

[五月 29 2015] NXP Semiconductors introduces a new portfolio of multi-channel LED driver ics for automotive lighting. The new multi-channel LED driver IC portfolio addresses the industry's growing need for a single, flexible and scalable platform architecture that enables new and existing full-range LED lighting capabilities for vehicle headlights and taillights. These features range from simple external LED li ...

2015-05 Connectors STMicroelectronics

[五月 28 2015] STMicroelectronics' new Industrial-Plus serial EEPROM memory with operating temperatures up to 105°C is the most comprehensive EEPROM memory on the market for storage capacity, bus interface and chip package selection. Gives designers more flexibility to update system data parameters without having to modify the printed circuit board design. The 34 new products belong to the M24(I2C) and M95(SPI) ...

2015-05 Power Broadcom

[五月 28 2015] Broadcom has announced the next generation of new additions to its StrataDNX (" Dune ") switching system-on-chip (SoC) family. Today, these new SOCs are widely recognized and adopted by the world's top equipment manufacturers, providing a complete solution for service provider networks ranging from dense and compact switching and routing platforms to large-scale multi-rack routers. Broadcom's new ...

2015-05 Semiconductors NXP

[五月 27 2015] NXP Semiconductors announced the launch of its latest UCODE product, UCODE DNA, the world's first UHF (ultra-high frequency) RAIN RFID tag IC that combines remote reading performance with cryptogenic verification. With this new tag IC, developers don't have to choose between contactless performance and application security needs, UCODE DNA allows them to do both in a single RAIN RFID tag IC. This ...

2015-05 Power Pervasive Displays

[五月 27 2015] Peregrine Semiconductor, founder of RF SOI (Silicon on Insulator) technology and pioneer of advanced RF solutions, now introduces the UltraCMOS PE42524, the industry's first RF SOI switch operating at frequencies up to 40 GHz. The switch significantly expands Peregrine's high frequency product lineup to frequencies previously dominated by gallium arsenide (GaAs) technology. As an alternative to G ...

2015-05 Power Broadcom

[五月 26 2015] Broadcom has announced the industry's first 28 nanometer (nm) electronic dispersion compensation (EDC) physical layer transceiver (PHY) that supports long range multimode (LRM). As the latest device in Broadcom's industry-leading 1/10/40GbE physical layer portfolio, the device significantly reduces power consumption and improves performance. Broadcom is showcasing its latest innovations in high-s ...

2015-05 Semiconductors Cypress Semiconductor

[五月 26 2015] Cypress Semiconductor announced the launch of a smart Bluetooth module that provides an end-to-end low energy Bluetooth solution. The new small-size EZ-BLE™ PRoC™ module is based on Cypress's PRoC BLE programmable on-chip RF solution and includes Bluetooth 4.1 certification and global frequency control certification, significantly simplifying design and reducing time-to-market. Cypress is the onl ...

2015-05 Sensors PulseR

[五月 25 2015] Pleora Technologies has announced a new harsh environment external image capture card that converts Camera Link Base cameras into GigE Vision 2.0 cameras. The iPORT CL-GigE external image capture card guarantees highly reliable video transmission from -40°C to +60°C, while bringing the benefits of Ethernet computing power, simplified cabling and networking to demanding military imaging, intellige ...

2015-05 Power Xilinx

[五月 25 2015] Xilinx has announced that its fully programmable devices are helping Blackmagic Design develop a complete 4K camera-on-chip system. The device is the core component of Blackmagic's URSA camera, which uses a 4K Super 35 large sensor with a full-field shutter and a 10-inch foldable display, The Blackmagic Design Production Camera 4K (BMPC 4K) is also the world's smallest Ultra HD4K cinema grade cam ...

2015-05 Power STMicroelectronics

[五月 24 2015] ST's automotive quality grade serial EEPROM comes in a 2mm x 3mm WFDFPN8 micro package, offering the industry's largest optional storage capacity. These memories provide maximum design flexibility when engineers are designing highly integrated body controllers, gateways, and radar and camera modules for Advanced Driver Assistance Systems (ADAS). The use of discrete serial EEPROM data parameter st ...

2015-05 Power Silicon Labs

[五月 24 2015] Silicon Labs has announced the industry's first complete wireless M-Bus platform solution for the European market, designed to simplify the development of wirelessly connected smart meters for electricity, gas, water and heat resources. Silicon Labs' complete smart metering solution includes the wireless M-Bus software protocol stack and wireless starter development kit to accelerate time to mark ...

2015-05 Semiconductors Broadcom

[五月 23 2015] Broadcom announced that its latest 40/50/100 Gigabit Ethernet (GbE) physical layer chip enables rapid adoption in pluggable QSFP+ fiber and DAC components. Several Oems and ODMs are already using the product in currently implemented projects To meet the growing demand for data traffic, network operators are looking for solutions that can leverage legacy cabling to improve data center cost and per ...