Technology Articles
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The SCHURTER compact with filter power input module KFA is now equipped with a ground wire choke
2015-03
Passive Components
Schurter
[三月 24 2015] SCHURTER's popular power input modules, the KFA series, are now equipped with an additional grounding choke to suppress high-frequency interference caused by the grounding loop of the grounding wire. In addition, the new grounding wire choke improves the high frequency asymmetric attenuation in the medical filter model. The KFA series' existing common mode chokes with phase and neutral lines, as ...
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C&K Components introduces the new CCM01 MK5 Series of small size smart card connectors
2015-03
Semiconductors
C&K
[三月 23 2015] C&K Components has introduced the new CCM01 MK5 series of small size smart card connectors. The range complies with Europay, MasterCard, Visa (EMV) and Payment card industry (PCI) standards and is perfect for point-of-sale (POS), mobile point-of-sale (mPOS), transaction and identification services. The CCM01 MK5 series smart card connector features a sealed card detection switch and a stable arch ...
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TDK introduces EPCOS buffer capacitor retriever
2015-03
Connectors
TDK
[三月 22 2015] TDK Group has launched EPCOS Buffer Capacitor Finder - an innovative online tool that helps users simplify and speed up the search for suitable buffer capacitors to protect IGBT modules from voltage spikes. With the buffer capacitor finder, users simply enter the manufacturer's IGBT code number at the search mask, and the online tool's integrated database covering the integrated data of more than ...
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Microchip launches a new family of microcontrollers offering multiple independent closed-loop power channels and system management capabilities
2015-03
Power
Microchip Technology
[三月 21 2015] Microchip Technology announced the release of its new PIC16(L)F1769 series 8-bit PIC microcontroller (MCU) products. The series is the first PIC MCU to offer up to two independent closed-loop channels. This is achieved through the addition of a programmable ramp generator (PRG) that automatically realizes slope and compensates for slope, increasing the stability and efficiency of hybrid power con ...
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Xilinx and BEEcube launch the world's first mmwave prototyping platform solution
2015-03
Power
Xilinx
[三月 20 2015] Xilinx and BEEcube announced the launch of the world's first millimeter Wave (mmWave) prototyping platform solution to support innovative development of 5G applications. Xylinx's new 256QAM 500MHz mmWave modem IP, combined with the BEEcube BEE7 baseband platform, provides a complete out-of-the-box solution to meet the needs of the 60GHz backrange market, enabling designers to immediately launch i ...
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Allegro introduces new Hall Effect speed and direction sensors
2015-03
Sensors
Allegro MicroSystems, LLC
[三月 19 2015] Allegro MicroSystems introduces a new Hall effect speed and direction sensor IC with hysteresis detection. The A1232 is an ultra-sensitive temperature-stabilized magnetic induction device that is ideal for ring-shaped speed and direction sensing systems in harsh automotive and industrial applications. The A1232 is the first of its kind and has the ability to detect when it is in the hysteresis ba ...
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STMicroelectronics Flexible and convenient STMCube software platform
2015-03
Connectors
STMicroelectronics
[三月 18 2015] Experience the speed and convenience of STMCube software development on STMicroelectronics STM32 microcontrollers. The STMCube development tool is available to support all current production STM32 microcontrollers. The STM32Cube makes it easier for designers to get started, thereby speeding up STM32 microcontroller application development and simplifying cross-system code migration. From ultra-lo ...
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STMicroelectronics introduces new Value series microcontrollers
2015-03
Connectors
STMicroelectronics
[三月 17 2015] STMicroelectronics has fully upgraded the capabilities of the STM32F0 Value series ARM® Cortex®-M0 microcontrollers. In order to increase support for cost-sensitive applications such as consumer electronics, smart meters, communication gateways and the Internet of Things, the new products add USB interfaces and increase flash memory capacity. A total of six new products were introduced, targeting ...
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Linear introduces the low phase noise integer N synthesizer core
2015-03
Connectors
Linear Technology/Analog Devices
[三月 16 2015] Linear Technology Corporation introduces the LTC6950, a low-phase noise integer N synthesizer core with an ultra-low jitter clock distribution output circuit. The LTC6950 is ideal for generating and distributing low-jitter signals essential for high signal-to-noise ratio (SNR) clock data converters. When digitizing or synthesizing high analog frequencies, keeping the data converter clock jitter l ...
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STMicroelectronics introduces new BlueNRG-MS Bluetooth 4.1 network processor
2015-03
Connectors
STMicroelectronics
[三月 15 2015] STMicroelectronics announces the latest iteration of its award-winning BlueNRG Bluetooth SMART network processor. The new processor supports the latest Bluetooth 4.1 specification and introduces a 1.7V operating mode to extend the life of battery-powered products. The new BlueNRG-MS network processor integrates a fully functional Bluetooth PHY and 2.4GHz RF circuit, as well as a dedicated securit ...
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Microchip introduces 4 Mb and 8 Mb 1.8V low-power memory
2015-03
Connectors
Microchip Technology
[三月 14 2015] Microchip Technology announced the SST26WF080B and SST26WF040B devices, extending its 1.8V Serial Quad I/O(SQI)SuperFlash memory family. Available in both 4 Mb and 8 Mb storage capacities, the new devices are manufactured using Microchip's high-performance SuperFlash technology to deliver the industry's fastest erase times and superior reliability. Thanks to the use of SuperFlash technology, the ...
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TE introduces high-speed multiple input/output connectors for portable devices
2015-03
Connectors
TE Connectivity
[三月 13 2015] TE Connectivity introduces the industry's first high-speed Multiple Input/Output product (HSMIO). As a new member of TE's product family, this input/output (I/O) connector solution combines the form factor of Micro USB 2.0 with the data transfer capability of USB 3.1 for slimmer mobile and wearable devices. It can meet the increasing demand of mobile devices for more functions, faster speeds, lar ...