Technology Articles
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The Molex Stac64 product range is certified to the most stringent automotive OEM standards
2012-02
Power
Molex
[二月 2 2012] Molex announced that its Stac64 Stackable Connection System has been successfully approved by major automotive original equipment manufacturers from Germany, France and Japan. OEM) the most stringent specification verification. In addition, a new patent has been issued for the Stac64 design. Selvan Wilhelm, Global Product Manager at Molex, said: "Since the launch of the Stac64 product line two ye ...
Silicon Labs expands its portfolio of PCIe clock generators and clock buffers
2012-02
Connectors
Silicon Labs
[二月 1 2012] Silicon Labs announced the expansion of its PCI Express (PCIe) clock generator and clock buffer portfolio to provide the industry's broadest range of clock solutions to meet the stringent requirements of the PCIe Gen 1/2/3 standard. Silicon Labs' expanded PCIe timing portfolio includes the existing Si5214x clock generator and Si5315x clock buffer for power - and cost-sensitive PCIe applications. ...
Cypress has announced a breakthrough feature for its Gen4 TrueTouch touchscreen controller
2012-01
Semiconductors
Cypress Semiconductor
[一月 31 2012] Cypress Semiconductor announced a breakthrough feature for its Gen4 TrueTouch touch screen controller that significantly improves system performance at no additional cost. Cypress has now developed a new proprietary technology based on the patent-pending Gen4 high voltage Tx driver. Tx-Boost™ extends Gen4's performance leadership by tripledsignal-to-noise ratio (SNR) without the need for performa ...
Microsemi introduces single-chip, standardized, synchronous Ethernet solutions
2012-01
Semiconductors
Microsemi
[一月 30 2012] Microsemi Corporation has announced the world's first single-chip, standardized Synchronous Ethernet (SyncE) solution that enables synchronous Ethernet (SyncE) transmission over Optical Transport network (OTN) channels without the need for additional frequency conversion phase locked loops (PLL). The new ZL30153 and ZL30154 clock devices support Ethernet clock frequencies and all OTN clock freque ...
IR introduces the AUIR0815S gate driver IC for compact cars
2012-01
Connectors
IRTouch Systems
[一月 29 2012] International Rectifier Corporation (IR) introduces the AUIR0815S, an automotive IC with A high output current of more than 10 A, capable of driving large IGBTs and MOSFETs at the inverter level. Suitable for power systems in hybrid and electric vehicles. The AUIR0815S 'ultra-low output impedance and low power losses allow it to operate in harsh and high-temperature environments. Typical output r ...
Xilinx's first 7 series FPGA target design platform is available
2012-01
Power
Xilinx
[一月 28 2012] Xilinx announced the launch of its first targeted design platforms to accelerate the development and integration capabilities of 28nm 7-series FPGA systems. Xilinx's targeted design platform approach to FPGA system design and integration offers the industry's most comprehensive development kit, including development boards, ISE design kit tools, IP cores, reference designs, and FPGA sandwich card ...
Linear introduces ultra-wideband wide direct conversion I/Q demodulators
2012-01
Connectors
Linear Technology/Analog Devices
[一月 27 2012] Linear Technology Corporation introduces the LTC5585, an ultra-wideband wide direct conversion I/Q demodulator with superior linear performance (IIP3 = 25.7dBm, IIP2 = 60dBm at 1.95GHz). The LTC5585 delivers more than 530MHz of baseband output demodulation bandwidth to meet the bandwidth needs of next-generation broadband LTE multimode receivers and digital predistortion (DPD) receivers. I/Q demo ...
Infineon introduces the innovative H-PSOF package for automotive electronics
2012-01
Semiconductors
Infineon Technologies
[一月 26 2012] Infineon Technologies AG has introduced an innovative packaging technology that delivers greater current tolerance and efficiency for demanding automotive electronics applications such as pure electric and hybrid vehicles. The new TO package complies with the JEDEC standard H-PSOF (heat-dissipating plastic small shape flat lead). The first products to be introduced in the H-PSOF package technolog ...
Cirrus Logic introduces new power measurement ics for smart grid applications
2012-01
Power
Cirrus Logic Inc.
[一月 25 2012] Cirrus Logic announced the introduction of the CS5844/80/90 Analog Front End (AFE) IC product line with the industry's highest electrical energy measurement accuracy, bringing designers of single-phase and multiphase utility meters and smart energy products an outstanding combination of proven electrical energy calculation, flexibility, performance and low cost. According to IMS, a research firm, ...
Texas Instruments introduces the OMAP4470 processor
2012-01
Connectors
Texas Instruments
[一月 24 2012] At CES 2012, Texas Instruments showed off an OMAP4470 processor tablet running on the Windows 8 pre-release operating system, demonstrating how the new OMAP4 platform fully supports Microsoft's latest computing experience that reinvents Windows. Designed for the ultimate tablet experience, the OMAP4470 processor delivers rich multimedia, end-to-end security, and powerful multitasking, all key fea ...
Exar introduces multi-protocol serial transceiver
2012-01
Connectors
ERP Power, LLC
[一月 23 2012] Exar has added the SP338 to its family of single-chip RS-232/RS-485/RS-422 multi-protocol serial transceivers. This new product complements Exar's existing serial transceiver product line and further extends Exar's leadership in the single-chip, multi-protocol transceiver market. The SP338 is ideal for industrial or embedded PCS that require a multi-protocol serial interface. The RS-232 mode has ...
Maxim introduces a mono, 3.2W Class D amplifier
2012-01
Connectors
Maxim Integrated
[一月 23 2012] Maxim Integrated Products, Inc. introduces the industry's first mono, 3.2W Class D amplifier with integrated input coupling capacitors, the MAX98314.The MAX98314 has a built-in input capacitor that enables ultra-small scheme sizes of 1mm x 1mm, saving at least 25% of board space. Devices are ideal for portable electronics with limited PCB area, including: mobile phones, portable audio devices, la ...