How is AMD using 3.5D packaging technology to accelerate AI computing

Nowadays, the development of science and technology is so fast that artificial intelligence (AI) has become an important field that cannot be ignored in all walks of life. With the growing demand for artificial intelligence computing, traditional 2D packaging technology has fallen behind in terms of performance and efficiency. At this time, AMD made a very innovative 3.5D packaging technology, which suddenly redefined the boundary of computing performance and strengthened the waist of AI computing.

Let's talk about 3.5D packaging technology first. This technology, ah, is a very advanced packaging method that connects multiple chip modules through the silicon Interposer. Its most powerful place is that it can make the connection between different process nodes and different functions of the chip efficient and smooth, so that computing resources are used more efficiently. In a 3.5D package, the AK7712AVTP chip can not only be stacked up and down, but also achieve very high bandwidth communication in the left and right directions, laying a particularly ideal foundation for multi-core processing and parallel computing.

Let's take a look at the challenges facing AI computing. In AI computing, especially when deep learning models are engaged in training and reasoning, they have to deal with much more data and the calculations are very complex. These tasks typically require very large computing power and efficient memory bandwidth. However, as the amount of data continues to increase, traditional 2D packaging technology slowly begins to suffocate due to bandwidth and delay limitations, and performance cannot be improved.

Moreover, AI model training can rely too much on the computing power of GPU (graphics processing unit) and TPU (tensor processing unit), but due to power consumption and heat dissipation problems, the efficiency of the traditional architecture is increasingly unable to meet the needs of the market.

What are the advantages of AMD's 3.5D packaging technology? There's a lot to talk about.

1. It can achieve high bandwidth and low latency communication. This kind of communication between chips is too useful for AI computing, allowing data to run very quickly between individual processing units, reducing data transfer time to a very short amount, which can greatly speed up the process of training and reasoning.

2. Can make many chips with different functions (such as CPU, GPU and dedicated accelerator, etc.) work together. In all aspects of AI computing, such as data processing, model training, and inference, the most suitable chip modules can be efficiently processed, thereby improving overall performance.

3. It can integrate video memory and processor modules directly together. Such a design can be too large, and the memory bandwidth can be raised very high at a time, which is more convenient to handle large-scale AI data sets, especially when it comes to deep learning, and can greatly reduce the kind of latency brought about by frequent data transmission.

4. Flexible thermal management. AMD designed the 3.5D package with thermal management in mind. With flexible thermal design, AMD's products can operate stably even under high load conditions, and long-term AI computing work will not cause performance degradation. This thermal management, done well, not only makes the equipment more durable, but also ensures that there is always continuous computing power.

In practical applications, AMD's 3.5D packaging technology has shone in many AI application scenarios, and its performance is quite strong. For example, in large data centers, processors based on 3.5D packages can efficiently support data analysis, machine learning, and deep learning tasks. Cloud service providers and enterprises deploying AMD high-performance processors can deliver fast and cost-effective computing services.

In applications such as autonomous driving, medical imaging and financial modeling, processors with 3.5D packaging technology can not only handle more complex algorithms, but also enable real-time data analysis. This capability is unmatched by traditional computing architectures, which adds new impetus to the development of these industries.

Looking ahead, as the demand for AI computing continues to rise, AMD's 3.5D packaging technology will certainly become increasingly important in future data centers and AI computing platforms. If AMD continues to optimize this technology, it can not only improve the performance of its own products, but also move the entire industry in a more efficient and intelligent direction.

Whether in the precision of hardware design, or in the mining of computing efficiency, AMD's 3.5D packaging technology has great potential. If AMD continues to engage in technological innovation and then goes to the market to explore more, it may be able to make a louder voice in the field of AI computing and bring some new vitality to all walks of life.