Littelfuse low capacitance transient suppression diode arrays are an affordable alternative to semiconductor-based common mode filters

Littelfuse, Inc., a leading global provider of circuit protection solutions, announced the introduction of low-capacitance transient suppression diode arrays optimized for the protection of electronic devices that may experience damaging electrostatic discharge (ESD). The SP814x series Transient Suppression Diode Array (SPA diode) integrates four or six ultra-low capacitance rail-to-rail diode channels as well as additional Zener diodes to safely absorb repeated ESD discharges above the highest level (±8kV contact discharge) specified in the IEC61000-4-2 international standard without performance degradation. Ultra-low load capacitance (1.0pF per input/output), lower series resistance than semiconductor devices, and fast response make it ideal for protecting electronic devices equipped with high-speed signal pins, such as HDMI2.0, USB3.0, USB2.0, and IEEE1394.

Applications for the SP814x series include LCD/PDP TVS, external memory, DVD/ Blu-ray players, desktop computers/servers, laptops/tablets, set-top boxes, mobile phones, flash memory cards and digital camcorders.

"The SP814x series is an affordable alternative to semiconductor common mode filters (CMFS), which, while believed to deliver value, cannot filter unwanted signals or noise fast enough, which creates signal integrity issues." Tim Micun, product manager for transient suppression diode Arrays. "For most high-speed interfaces, the use of such CMF devices means overly detailed requirements for circuit protection and cost overruns. As small as CMF devices, the SP814x series transient suppression diode arrays are a low-cost option that is easy to use without compromising ESD protection performance."

The SP814x series transient suppression diode array offers the following outstanding advantages:

• Low capacitance (1.0pF(typ.)) minimizes signal deterioration or attenuation for high-speed data, giving engineers more signal margin in their designs.

• Low leakage current (25nA(TYP) at 5V) is beneficial for extending battery life and protecting signal integrity, as excessive leakage can be considered as additional capacitance for high-speed differential pairs.

• Enhanced ESD capabilities (±22kV contact discharge, ±22kV air discharge) enable manufacturers to achieve ESD protection beyond the highest levels of IEC standards, as well as a host of other threats to ensure product reliability in real-world use.

• The compact form factor (μDFN, JEDEC MO-229 package) saves valuable board space, simplifies board layout and protects space-constrained applications such as smartphones. The footprint is the same as that of semiconductor CMF, allowing through-wiring for ESD-only solutions.