Microsemi introduces automotive grade SoC FPgas and FPGA devices

     Microsemi Corporation announced the availability of new automotive-grade field-programmable gate array (FPGA) and system-on-chip (SoC) FPGA devices. The next generation of flash-based, low-power FPGas and ARM® Cortex-M3 enabling SoC FPGA devices have received AEC-Q100 Level 2 certification, an industry standard specification that Outlines standards for electronic components to ensure that the final system meets automotive reliability levels. The new automotive grade qualified SmartFusion 2 and IGLOO 2 devices are the only devices in the industry that provide the advanced safety and high reliability critical for automotive applications.

     Bruce Weyer, vice president and business unit manager at Microsemi Corporation, said: "Safety and reliability are major considerations for automotive applications, and these devices ensure their safety by avoiding tampering and cloning of customers' designs, data and hardware. In addition, the single event flip (SEU) immunity of these devices provides protection against neutron-induced firmware errors, helping customers achieve zero defect rates - a fundamental requirement in the automotive industry."

     Microsemi Corporation's new flash-based automotive grade SOCs and FPGA devices build on the company's long tradition of providing highly reliable devices with long-term product lifecycle support. The new device is the most suitable ASIC device replacement offering a safe and reliable solution with low power and high cost effectiveness for automotive applications, including Advanced Driver assistance systems (ADAS), vehicle-to-vehicle/vehicle-to-everything (V2V/V2X) communications and electrical/hybrid engine control units. In addition to AEC-Q100 certification, Microsemi Corporation provides customers with SEU immunity, award-winning safety features and a secure supply chain.

     The new devices target the rapidly growing automotive electronics sector and the industry's growing demand for high reliability and security for zero-defect and tamper-free applications. Colin Barnden, principal analyst at Semicast Research, a market research firm, commented: "The automotive semiconductor market is expected to rise from $29.4 billion in 2014 to $31.4 billion in 2015, an increase of nearly 7%. In comparison, we saw the semiconductor market for vehicle connectivity and ADAS grow by more than 20% in 2015. Microsemi's SmartFusion2 and IGLOO2 devices bring world-class security features to the automotive industry and will address many of the challenges system designers face when creating security systems for the connected car of the future, such as hacking, malicious tampering and data theft."