NXP introduces low VF Schottky rectifier

     NXP Semiconductors has set an important new benchmark for miniaturization by announcing a new generation of low-VF Schottky rectifiers for the mobile device market. The new DFN1608D-2 (SOD1608) plastic package has A typical thickness of just 0.37 mm and dimensions of 1.6 x 0.8 mm, making it the smallest device on the market to support up to 1.5A currents. The DFN1608D-2 includes a total of six Schottky barrier rectifiers: three 20V models for very low forward voltages and three 40V models for very low reverse currents. The average forward current ranges from 0.5 to 1.5A.

     NXP's new Schottky rectifier not only offers significant space savings, but also industry-leading power characteristics thanks to a large heat sink at the bottom of the package. The extremely low forward voltage of these Schottky diodes can reduce power consumption, thereby extending the battery life of mobile devices. Typical applications include battery charging, display backlighting, switching mode power supply (SMPS), and DC/DC conversion for small portable devices. The 1.5A model can be used in larger devices such as tablets.

     The DFN1608D-2 series of rectifiers is also very attractive to equipment manufacturers because of the unique side pad, which can effectively prevent oxidation, thus ensuring the weldability of the side. Unlike other pin-less solutions where the solder contacts are hidden under the package, this side pad helps prevent the package from tilting on the PCB, further improving the PCB's flatness and maximizing stack density. In addition, the package is welded from the side to facilitate visual inspection of the contacts. The DFN1608D-2 also increases the cost efficiency of the production process by eliminating the need for expensive and complex X-ray equipment to inspect welding contacts.

     Dr. Wolfgang Bindke, Diode Product Market Manager at NXP, said: "For mobile device designers, these devices represent a real breakthrough in both miniaturization and current density, increasing the functional options at that size like never before. For ultra-thin applications such as smart phones, we produce the market's flattest pin-less plastic packages of 1A(and above), with only devices four times their size on the market today with the same level of performance parameters. This collection is another great example of NXP's innovative, customer-centric design."