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ROHM announces New SiC solid State Drives for high-voltage xEV systems

十一月 25 2024 2024-11 Semiconductors Rohm Semiconductor
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ROHM has developed surface mount SiC SBDs that improve insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models – SCS2xxxNHR – for automotive applications such as OBCs, with plans to deploy eight models – SCS2xxxN – for industrial equipment such as FA devices and PV inverters in December 2024.

     Rohm has developed surface mount SiC sdd to increase insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models - SCS2xxxNHR - for automotive applications such as obc, with plans to deploy eight models - SCS2xxxN - for industrial equipment such as FA devices and photovoltaic inverters in December 2024.

     A pplication examples include automotive applications such as OBCs, DC-DC converters, etc. Industrial equipment includes AC servo motors for industrial robots, photovoltaic inverters, power regulators, UPS, etc

    The rapidly expanding xEV market is driving the demand for power semiconductors, including SiC sdd, which provide low calorific value as well as high-speed switching and high-voltage functions in applications such as on-board chargers. Manufacturers are also increasingly relying on compact SMDS compatible with automated assembly equipment to improve manufacturing efficiency. Compact SMDS typically have a small creepage distance, which makes preventing high-voltage tracking a key design challenge.

     As a leading SiC supplier, the company has been developing high-performance SiC sdd that provides breakdown voltages suitable for high voltage applications and is easy to install. The optimized package shape allows for a minimum creepage distance of 5.1mm, which improves insulation performance compared to standard products.

     The new product takes the original design and removes the center pin previously located at the bottom of the package, extending the creepage distance to a minimum of 5.1mm, approximately. 1.3 times higher than standard products. This minimizes the possibility of tracking (leakage discharge) between terminals, eliminating the need for insulation by resin potting when the device surface is mounted on the circuit board in high voltage applications. These devices can also be installed in the same ground mode as standard and conventional TO-263 package products, making it easy TO replace existing boards.

     Both 650V and 1200V voltage ratings are available to support the 400V systems commonly used in XEVs, while higher voltage systems are expected to gain wider adoption in the future. The automotive grade SCS2xxxNHR is AEC-Q101 certified, ensuring that they meet the high reliability standards required in this application area.

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