STMicroelectronics ST4SIM-200M eSIM GSMA System on Chip (SoC)

The STMicroelectronics ST4SIM-200M eSIM GSMA System-on-Chip (SoC) is designed to manage various MNO profiles and ensure that all eSIM stakeholders have the appropriate level of security. Stakeholders include users, Mnos, Oems, hardware integrators and service providers.

This SoC can contain an embedded security element to store credentials and/or stand-alone applications managed directly by an MCU or another OEM element. The ST4SIM-200M eSIM GSMA SoC provides a secure and interoperable Java Card environment, compatible with Java Card v3.0.4 Classic. The SoC integrates state-of-the-art UICC capabilities that comply with GlobalPlatform, ETSI, 3GPP, and 3GPP2 specifications.

The ST4SIM-200M eSIM GSMA SoC is based on the ST33G1M2M Industrial Grade Hardware Solution (JEDEC) and is a tamper-proof security element certified by the common standard EAL5+. The solution comes with a powerful 32-bit Arm SecurCore SC300 RISC core. The SoC implements a variety of security features such as DES/3DES/AES symmetric encryption, RSA(up to 2048 bits) asymmetric encryption, and HTTPS remote management TLS v1.0, v1.1 and v1.2.

Other security features include elliptic curve cryptography (up to 521 bits), including preloaded curve NIST P-256 and cib P256r1. Authentication algorithms include MILEAGE, TUAK, and CAVE. Typical applications include cellular connectivity nodes, Cat M1 and NBIoT LTE, monitoring, iot for smart homes and cities (such as gas metering), and iot for smart industries.

Features

● Remote SIM provisioning is compatible with the GSMA M2M and SIMalliance specifications

● A boot connection profile provided by a trusted partner

● Up to 7 connectivity profiles (depending on memory size)

● Compatible with 2G / 3G / 4G (LTE)/CDMA/NB-IoT/CAT-M network

● Supported access applications :SIM/USIM/ISIM/CSIM

● Secure element access control (ARF/PKCS#15)

● OTA capabilities via SMS, CAT-TP, and HTTPS(including DNS)

● Supports eSIM + eSE multi-interface combination

● ECOPACK-compliant package:

-   2FF, 3FF, 4FF plug-in card (based on D16 micromodule)

-   5mm × 6mm VFDFPN8 with Wettable Sides (MFF2)

-   WLCSP11

Applications

● Cellular-connected node

● Cat M1 and NBIoT LTE

● Monitoring

● Internet of Things for smart homes and cities, such as gas metering

● Internet of Things for smart industries, such as tracking