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Silicon Labs introduces the world's smallest Bluetooth SiP module for IoT end nodes

二月 1 2017 2017-02 Power Silicon Labs
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Silicon Labs has introduced the industry's smallest Bluetooth low energy system-in-package (SiP) module with a built-in chip antenna that provides a complete, low-cost connectivity solution without compromising performance. The BGM12x Blue Gecko SiP module comes in a compact 6.5mm x 6.5mm package that allows developers to reduce the PCB board area, including the antenna gap, to 51mm2, enabling miniaturization of IoT designs.

     Silicon Labs has introduced the industry's smallest Bluetooth low energy system-in-package (SiP) module with a built-in chip antenna that provides a complete, low-cost connectivity solution without compromising performance. The BGM12x Blue Gecko SiP module comes in a compact 6.5mm x 6.5mm package that allows developers to reduce the PCB board area, including the antenna gap, to 51mm2, enabling miniaturization of IoT designs. Applications for this ultra-small, high-performance Bluetooth module include sports and fitness wearables, smartwatches, personal medical devices, wireless sensor nodes and other space-constrained connected devices.

     Based on Silicon Labs' Blue Gecko Wireless SoC, the BGM12x module provides an all-in-one Bluetooth connectivity solution that includes an ARM®Cortex®-M4 processor, a high-output Bluetooth power amplifier, a high-efficiency built-in antenna, external antenna options, an oscillator, and passive devices. As well as reliable and secure Bluetooth 4.2 protocol stack and first-class development tools. The BGM12x module's high-level SiP integration eliminates the need for developers to worry about the complexities of RF system engineering, protocol selection and antenna design, allowing them to focus more on the final application design. The module is small in size and easy to use in space-conscious battery-powered applications, including those with low-cost, dual-layer PCB designs.

     Daniel Cooley, senior vice president and general manager of IoT products at Silicon Labs, said: "Small size is just as important to IoT end-node design as ultra-low power, low system cost and high integration. Small package and big surprise, in the low power Bluetooth market there is nothing comparable to the BGM12x module. By integrating all the required hardware and software components, including the Bluetooth 4.2 compatible protocol stack, the BGM12x SiP module enables developers to quickly and easily develop compact Bluetooth designs."

     Like all other Blue Gecko modules from Silicon Labs, the BGM12x module provides developers with flexibility based on module design, and it is able to convert to the Blue Gecko SoC with minimal system redesign costs and complete software reuse. To help developers further miniaturize wearable designs and other Bluetooth-enabled IoT products, the Blue Gecko SoC comes in an ultra-small (3.3mm x 3.14mm x 0.52mm) wafer-scale chip size package (WLCSP).

     The BGM12x module is pre-certified for use in many key markets around the world, minimizing development costs while also greatly reducing the amount of work developers have to do to be compatible with the RF specification. All application code can be run on the BGM12x module without the need for an external MCU, which helps reduce system cost, board area, and time to market. In addition, Bluetooth Low Energy application profiles and examples also help simplify development.

     The BGM12x Blue Gecko module and WLCSP SoC products are supported by the same software architecture that was developed for Silicon Labs' popular BGM11x module, as well as the EFR32BG SoC packaged in QFN. Silicon Labs' Wireless Software Development Kit (SDK) provides developers with the development flexibility to use an external host or to run completely standalone through the easy-to-use BluegigaBGScript™ scripting language or ANSI C programming language. Silicon Labs' Bluetooth SDK has been upgraded and supports new Bluetooth 4.2 features, such as LE Secure connectivity for more secure Bluetooth bindings, LE packet length extension for improved throughput, and LE dual topologies for multiple simultaneous central and peripheral functions.

     The BGM12x module has different transmit output power options, from 3dBm(BGM123) to 8dBm(BGM121), to support connectable device applications with different range requirements.

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