Surface-mount package offers new LFPAK 5x6 package extensions

     Alpha and Omega Semiconductors has expanded its new highly robust power MOSFET LFPAK 5x6 package. Its new LFPAK products offer a wide range of voltages :40V, 60V and 100V. It is designed to withstand harsh environments while maintaining the performance of the MOSFET. This new device is widely used in industrial, server power, telecommunications, solar energy and other areas requiring high reliability.

     The company's LFPAK package offers increased board-level reliability thanks to key package features such as gull-wing leads, providing a robust solution to environmental stresses at the board level. The Gull-wing leads also allow optical inspection during PCB manufacturing. Another feature is the LFPAK's larger copper clip, which improves electrical and thermal performance. Advantages of large clamps include enhanced current handling capability, reduced on-resistance, and better heat dispersion compared to wire bonding.

     A large clip also has low parasitic inductance, enabling lower peak voltages in switching applications. All of these features greatly improve the robustness of the MOSFET and use the company's advanced shielding gate. MOSFET technology (AlphaSGT) enables designers to find optimized solutions that achieve high reliability in the harshest environmental conditions.

     Peter H. Wilson, Senior Director of MOSFET product line marketing at AOS, said: "Designers have long trusted AOS power semiconductors in their applications, and the LFPAK 5x6 will extend the capabilities of the solution.