The Engine of the future of computing: Secrets of multi-chip packaging technology

     Today, with the rapid development of science and technology, people's demand for computing is also increasing, and the traditional single-chip method can not meet the requirements of high performance and high efficiency in modern applications. In this context, multi-chip packaging (which we call MCP) technology emerged and became one of the important forces driving the future of computing. By putting multiple chips into a single package, the technology not only gives the system more computing power, but also makes it more integrated and energy efficient.

     Let's talk about the basic concept of multi-chip packaging technology. This is a technique that combines several integrated circuit chips with different functions, or several chips with the same functions, in order to make computer systems smaller, compute faster, and save power. Compared with the traditional SCM integration method, this technology can improve the system performance by optimizing the design.

     This technology generally has several packaging forms, such as 3D packaging, system level packaging (SiP), chip level packaging (WLP), and so on, each form has its own specific uses and advantages.

     Let's take a look at 3D packaging, which is a new thing that breaks the limitations of space. 3D packaging technology can stack chips vertically, saving a lot of board space and improving data transmission speed. The technology makes the connection between the chips tighter and improves the transmission efficiency and bandwidth of the signal. In 3D packages, the chips are powered through micro-bumps or through-silicon holes (TSVS), which shorten the distance between the chips and reduce signal delay and power consumption. Due to its performance, the technology is used in high-performance computing, artificial intelligence chips, and graphics processing units (Gpus).

     Then there is system-level packaging (SiP), a technique that puts multiple functional modules such as the processor, HY5118164BDC-60 memory, and other peripherals in a single package. SiP can be flexible, and the installed functional modules can be adjusted as needed, making product design more comfortable, and the number of components is much less, and production costs will be reduced. In places like mobile devices and the Internet of Things (IoT), SiP is heavily used because it can provide powerful capabilities while controlling overall volume and energy consumption. Today's smartphones, wearables and smart home devices all like to use SiP technology to be smaller and more cost-effective.

     There is also chip-level packaging (WLP), which allows for the miniaturization of designs. WLP is to install the unpackaged chip on the substrate, and directly use the surface of the chip itself as the package structure, replacing the traditional plastic package. This packaging method can reduce the size of the chip a lot and is suitable for micro products. Due to its small size and low power consumption, it is commonly used in consumer electronics, mobile devices, and biomedical fields. Especially where space and heat requirements are particularly stringent, WLP can provide a good solution.

     Speaking of thermal management, this is also a benefit of multi-chip packaging technology. By putting multiple chips in a single package, designers can better control the heat distribution of the chip and use some advanced cooling materials and technologies to reduce heat buildup and make the chip more reliable and stable. These technologies, using heat pipes, phase change materials or thermal interface materials, can improve the heat dissipation efficiency of multi-chip packages and effectively prevent overheating from affecting chip performance. In addition, reasonable thermal design also helps to reduce the overall energy consumption of the system and improve the system performance.

     However, this multi-chip packaging technology also has many design problems. First, the integration of multiple chips is prone to radio and signal cross interference, and design engineers have to pay more attention to electromagnetic compatibility (EMC) and signal integrity (SI). Secondly, how to get the correct connection structure and thermal management design between the chips to ensure that the entire system can run efficiently is also a more troublesome thing. In addition, when manufacturing, how to achieve high-precision and high-yield packaging process to ensure the reliability and stability of products, which is also a problem that many technicians have to think about.

     Facing these problems, advanced design software, accurate simulation tools and the application of new materials are the key to the development of multi-chip packaging technology in the future. With this, designers can solve problems more efficiently, making designs more viable and products more competitive in the market.

     With the continuous progress of technology, multi-chip packaging technology will continue to develop in the direction of higher density, more functions and better performance. In particular, artificial intelligence, high-performance computing, and 5G communication are developing faster and faster, and there is an increasing demand for more complex and efficient multi-chip solutions.

     The multi-chip package of the future is not just a single integrated circuit, but will develop in the direction of smarter and more complex integration. Combined with artificial intelligence and machine learning, multi-chip packaging is expected to open a new era of computing technology, promote more application scenarios, and achieve more comprehensive technological breakthroughs.