Toshiba Memory Corporation introduces BGA NVMeTM SSD with 64-layer 3D flash memory

     Toshiba Memory Corporation today announced the launch of the BG3 series, a new lineup of single-package NVM Express (NVMe) customer-grade SSDS. It integrates Toshiba Memory Corporation's advanced 64-layer 3-bit-per-cell TLC(1 memory storage unit can hold 3 bits of data)BiCS FLASH™ memory and controller in a ball grid array (BGA) package.

     The new BG3 SSD family uses PCI EXPRESS(PCIe)Gen3 x 2 channel architecture, NVM Express(NVMe) version 1.2.1 protocol, and features host memory buffering (HMB). This feature replaces the DRAM of SSDS with host memory, which is expected to save power and design space on the system, helping developers of compact devices find a balance between high performance and low power consumption. In addition, the BG3 SSD family combines SLC caching features, flash management improvements, and flash memory performance improvements to achieve transfer performance of up to 1520MB/s for sequential read and 840MB/s for sequential write.

     This SSD series is available in three capacities: 128GB, 256GB and 512GB. All feature the industry's smallest SSD form factor specifications [4], namely the surface mount M.2 1620 single package specification of 16mm x 20mm x 1.5mm and the detachable M.2 2230[6] module specification. The BG3 series is more compact in form size than its predecessor, with 128GB and 256GB single-package products conforming to the 1.35mm thin specification of M.2 1620-S2, and 512GB single-package products conforming to the 1.5mm specification of M.2 1620-S3.

     This will help facilitate the new development of mobile and embedded devices, including thin mobile computers and tablets. At the same time, due to its small size and low power consumption, the BG3 SSD can also be used as a server boot memory that has certain requirements for space and power consumption in data center applications.