Verisilicon Bluetooth Low Energy Complete Bluetooth 5.3 certification

     VeriSilicon Holdings has announced that its total Bluetooth Low Energy solution has completed the Bluetooth 5.3 certification issued by the Bluetooth Technology Alliance (Bluetooth SIG). The overall solution includes radio frequency (RF) IP, baseband IP and software protocol stack independently developed by VeriSilicon, providing one-stop Bluetooth wireless connection solutions that meet the Bluetooth 5.3 specifications for industrial, automotive, smart home, smart city, medical and other iot fields, which can significantly reduce customer product design time, risk and cost, and accelerate product market.

     Bluetooth version 5.3 improves the low-rate connection, periodic broadcast, channel classification, etc. in the Bluetooth Low energy specification, and improves the wireless co-existence and security of Bluetooth devices. Verisilicon's total Bluetooth Low Energy solution is based on a 22nm FD-SOI process node with an RF transceiver IP with receiver sensitivity below -96dBm and a transmitter with a maximum transmit power of +10dBm.

     The digital baseband with low power design supports multiple power saving modes, greatly reducing the average power consumption of the system. The protocol stack software is BQB certified, ensuring interoperability with other standard Bluetooth devices and supporting the next generation of Bluetooth Audio (LE Audio) universal audio framework. The solution can be flexibly configured to support a variety of mainstream embedded processor architectures (Arm, RISC-V, etc.) and operating systems, and provides a comprehensive software development kit, software reference design and testing tools.

     Verisilicon Bluetooth Low Energy Total solution is an important part of the core iot wireless connectivity platform. At present, Verisilicon has developed a number of low-power and high-performance RF IP and baseband IP for Internet of Things applications, using a variety of processes such as 22nm FD-SOI, supporting a variety of technical standards and applications including Bluetooth, Wi-Fi, cellular Internet of Things, multi-mode satellite navigation and positioning. It has been integrated and mass-produced in many customer SoC chips.

     "Verisilicon's total Bluetooth Low Energy solution has achieved Bluetooth 5.3 certification, which fully demonstrates the core's advanced and complete wireless connectivity technology design capabilities. We have deep cooperation with leading international MCU companies based on this solution, and their leading low-power MCU products have been introduced to the market." Wang Zhiwei, senior vice president of Verisilicon and general manager of the custom chip Platform Division, said, "For the diversified application scenarios of the Internet of Things, Xinyuan has laid out a relatively complete RF IP product and platform solution on the 22nm FD-SOI process. Support dual-mode Bluetooth, low energy Bluetooth BLE, NB-IoT, multi-channel GNSS and 802.11ah Internet of Things connection technology, all RF IP has completed the IP test chip chip verification. In the future, Xinyuan will continue to in-depth layout of Internet of Things wireless connection technology to support more Internet of Things connection application scenarios."