NXP PMIC-電源管理-專業
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類別半導體 / 電源管理IC / PMIC-電源管理-專業
制造商NXP USA Inc.
記錄 595
頁面 20/20
圖片 |
型號 |
制造商 |
描述 |
庫存 |
數量 |
系列 | 應用程序 | 電流-電源 | 電壓-供電 | 工作溫度 | 安裝類型 | 包裝/箱 | 供應商設備包裝 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
SBC 5V 1CAN 1LIN 6SG HLQFP48 |
5,436 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
7,470 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
5,742 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
5,418 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC SG 1 CAN 0 LIN HLQFP48 |
2,970 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC SG 1 CAN 0 LIN HLQFP48 |
7,830 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
7,416 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
7,920 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 5V 1CAN 4LIN 6SG HLQFP48 |
5,976 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 5V 1CAN 4LIN 6SG HLQFP48 |
5,922 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC 3 BUCK REGS |
5,958 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC 3 BUCK REGS |
3,798 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
32BIT256K FLASHSTR CTM |
3,060 |
|
- | General Purpose | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
|
|
|
NXP |
32BIT256K FLASHSTR CTM |
7,758 |
|
- | General Purpose | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
|
|
|
NXP |
IC WIRELESS PWR RECEIVER WLCSP42 |
4,554 |
|
- | Wireless Power Receiver | 12mA | 6.1V ~ 18V | -40°C ~ 85°C | Surface Mount | 42-UFBGA, WLCSP | 42-WLCSP (3.56x3.41) |
|
|
|
NXP |
IC WIRELESS PWR RECEIVER WLCSP42 |
3,690 |
|
- | Wireless Power Receiver | - | - | -40°C ~ 85°C | Surface Mount | 42-UFBGA, WLCSP | 42-WLCSP (3.56x3.41) |
|
|
|
NXP |
IC WIRELESS PWR RECEIVER |
6,030 |
|
- | Wireless Power Receiver | 12mA | 6.1V ~ 18V | -40°C ~ 85°C | Surface Mount | 42-UFBGA, WLCSP | 42-WLCSP (3.56x3.41) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
3,384 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
3,366 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
2,376 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QXP |
8,532 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
6,264 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT |
3,582 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
3,472 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
4,392 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |