Technology Articles

2017-08 Power Vicor

[八月 24 2017] Vicor Corporation announced the introduction of modular current multipliers for high-performance, high-current CPU/GPU/ASIC(" XPU ") processor closures. The Vicor sealable power solution not only reduces the number of pins in the XPU socket, but also reduces the loss associated with pulling power from the motherboard to the XPU, thereby increasing the current supply and achieving maximum XPU perf ...

2017-08 Passive Components Littelfuse

[八月 23 2017] Littelfuse, Inc., a global leader in circuit protection, introduced the 80A discrete bidirectional transient suppression diode, the latest in the SP11xx family of bidirectional transient suppression diodes (SPA diodes). The SP1103C Series 80A discrete bi-directional transient suppression diode provides circuit designers with a lower off-state voltage for protecting low-voltage power supply buses ...

2017-08 Semiconductors US-Lasers Inc.

[八月 22 2017] UltraSoC, a leading developer of embedded analytics technology, has announced the full availability of a suite of debugging and monitoring intellectual property (IP) products for ARM's recently released AMBA 5 Coherent Hub Interface (CHI) Issue B specification. CHI Issue B is ARM's most advanced bus specification that supports complex system-on-chip (SoC) designs, and UltraSoC's monitoring and de ...

2017-08 Semiconductors Toshiba Semiconductor and Storage

[八月 21 2017] Toshiba Memory Corporation today announced the launch of the BG3 series, a new lineup of single-package NVM Express (NVMe) customer-grade SSDS. It integrates Toshiba Memory Corporation's advanced 64-layer 3-bit-per-cell TLC(1 memory storage unit can hold 3 bits of data)BiCS FLASH™ memory and controller in a ball grid array (BGA) package. The new BG3 SSD family uses PCI EXPRESS(PCIe)Gen3 x 2 chann ...

2017-08 Semiconductors Echelon Corporation

[八月 20 2017] German company ELMOS recently announced the launch of a new generation of ultrasonic chips E524.08 and E524.09 for automotive ultrasonic parking assistance systems. In addition to the automotive industry, the chips can also be used in industrial applications such as industrial robots, liquid level measurement, and distance measurement. Both chips comply with the AECQ-100 standard. And has been ma ...

2017-08 Semiconductors Cypress Semiconductor

[八月 19 2017] Cypress Semiconductor, a leader in wireless connectivity solutions for the Internet of Things, today announced the launch of an upgraded Internet of Things one-stop development platform that simplifies wireless connectivity integration for smart home applications. Wireless Internet Connectivity Solutions for Embedded Devices (WICED) Studio platform now adds iCloud remote access to Wi-Fi-connected ...

2017-08 Sensors Bosch Sensortec

[八月 18 2017] Bosch Sensortec has announced the launch of a new MEMS acceleration sensor for wearables, offering high-performance and easily integrated sensors in a compact package: the BMA456 has been designed for the motion and fitness tracking capabilities of wearables. Integrated pedometer The new acceleration sensor BMA456 from Bosch Sensortec includes a wearable product-optimized pedometer integrated dir ...

2017-08 Connectors United Chemi-Con

[八月 17 2017] U-blox, a global leader in wireless and positioning modules and chips, and Atoll Solutions, an industry-leading provider of IoT gateway platforms, sensor nodes and wireless modules, announced that Launch of the IoT starter kit based on u-blox's LTE Cat M1 and narrowband IoT(NB-IoT) modules. With the development of a comprehensive smart city program, India's infrastructure is shifting towards low ...

2017-08 Power Micron Technology Inc.

[八月 16 2017] Micron Technology Inc. has introduced the latest in its flagship line of performance solid state storage products, the Micron 9200 series NVMe solid State Drives (SSDS). With an innovative architecture and industry-leading performance, the Micron 9200 series SSD enables organizations to access data faster and prepare for diverse business-critical workloads and surging data demands. The new Micron ...

2017-08 Power Maxwell Technologies

[八月 15 2017] Marvell, a leader in semiconductor solutions for storage, networking and wireless connectivity, announced the 88W8987xA, the world's first automotive IC with integrated Wi-Fi, Bluetooth, vehicle-to-vehicle and infrastructure capabilities. This highly advanced IC supports Wi-Fi, Bluetooth 5.0 and 802.11p, making it the perfect solution for in-car applications. Today's connected cars are placing un ...

2017-08 Connectors FLIR Lepton

[八月 14 2017] Now, electronic components and printed circuit boards are running faster and faster, smaller and smaller, through the use of small parts to achieve high performance, high speed, to reach picosecond (trillionth of a second) level of accuracy has become a trend, but this also means that parts will heat, and even short circuit or damaged parts. So detecting these heat-damaged parts is a challenge fo ...

2017-08 Power Maxwell Technologies

[八月 13 2017] Marvell, a leader in semiconductor solutions for storage, networking and connectivity, announced the industry's first safety-enabled automotive-grade Gigabit Ethernet switch that will deliver a new level of secure data transfer for the next generation of connected vehicles. There are hundreds of computing applications in the car that require a robust, reliable and secure in-vehicle network, makin ...