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Technology Articles

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Car class module with Wi-Fi 6E and Bluetooth LE audio capabilities

2023-04 Power United Chemi-Con
[四月 27 2023] U-blox announced the launch of the u-blox JODY-W4 automotive class module, which integrates cutting-edge Wi-Fi 6E technology and Bluetooth LE audio capabilities into all sub-models of the module. The off-the-shelf solution is compact and compact in size (13.8x19.8x2.5mm) with a total of three antenna ports and integrated with Infineon's chipset (89570/89570B). In addition, the module is compatibl ...
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Ams introduces a new 256-channel ADC

2023-04 Power ams
[四月 26 2023] Ams has announced the introduction of a 256-channel analog digital converter, the AS5911, for the digitization of photodiode array signals in high-performance computed tomography (CT) devices. The converter is a system-level packaging solution that enables simultaneous digital current conversion of 256 photodiode outputs in a CT detector in a 14mm x 14mm FBGA package. The AS5911 has on-chip calib ...
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Ultra-small programmable precision DC-DC high voltage power supply

2023-04 Optoelectronics Advanced Energy
[四月 26 2023] Advanced Energy introduces a new line of ultra-small isolated single - and dual-output DC-DC high-voltage power supplies. The AEQ family is optimized for power conversion in a wide range of medical, life sciences, industrial and semiconductor device applications. This DC-DC high-voltage power supply provides precision, stable output voltages in a small size and enhanced isolation to support criti ...
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Vishay has introduced a new line of automotive grade vPolyTan™ surface mount polymer tantalum molded chip capacitors

2023-04 Semiconductors Vishay
[四月 26 2023] Vishay Intertechnology has announced the launch of a new line of automotive grade vPolyTan™ surface mount polymer tantalum molded chip capacitors - the T51 series. The series of capacitors are lead-free (Pb) terminating, comply with RoHS and Vishay green standards, and are halogen-free. The AEC-Q200 certified Vishay Polytech T51 series capacitors improve performance under high temperature and hum ...
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ST launched single chip antenna matching IC, Bluetooth LE SoC and STM32 wireless MCU, make RF design easier and faster

2023-04 Semiconductors STMicroelectronics
[四月 26 2023] STMicroelectronics Single antenna matching IC series added two new optimized products for BlueNRG-LPS system chip (SoC), and STM32WB1x and STM32WB5x series wireless MCU. Monolithic antenna matching IC helps simplify RF circuit design. The BlueNRG-LPx system chip can be used independently or in conjunction with a network processor and supports Bluetooth Low Energy 5.3 features, including point-to- ...
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TDK launches Ultra compact motor run capacitor

2023-04 Power TDK
[四月 26 2023] TDK introduces the new EPCOS B33331I6 series compact motor running capacitors. These motors operate capacitors in a wide range of applications, typically air compressors in refrigerators and freezers, and industrial pumps. The new line of capacitors has a safety rating of up to S2, which meets IEC 60335-2-24 standards, and features an ultra-compact aluminum can design, which is expected to be the ...
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Infineon introduces the latest generation of MERUS™ multilevel Class D audio amplifiers

2023-04 Semiconductors Infineon Technologies
[四月 26 2023] Achieving long-lasting music playback performance in a compact, cost-effective and energy efficient design is critical, especially for battery-powered applications. As a global semiconductor leader in power systems and the Internet of Things, Infineon Technologies has introduced the latest generation of MERUS™ multilevel Class D audio amplifiers, enabling its multiple eco-partners to now support ...
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Molex introduces four rows of board-to-board connectors

2023-04 Power Molex
[四月 26 2023] Molex's four rows of board-to-board connectors. These connectors use a staggered circuit layout and a thin 0.175mm foot spacing design, and are patented to save 30 percent of space compared to traditional connectors. They give product developers and device manufacturers the freedom and flexibility to support compact dimensions and are ideal for augmented/virtual reality (AR/VR), automotive, commu ...
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New rotary door locks with anti-vibration and cable mounting brackets

2023-04 Sensors SOURIAU-SUNBANK
[四月 26 2023] Southco, a leading global provider of engineering hardware solutions, has added two new products with built-in vibration resistance and cable mounting bracket to its line of heavy-duty R4 rotary door locks. Sokco's new R4-30 rotary door lock product suppresses vibration noise and simplifies cable installation for applications requiring remote locking. The Southco R4-30 Rotary door lock with built ...
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Vishay Intertechnology has introduced two new seventh generation 1200V FRED Pt® Hyperfast recovery rectifiers

2023-04 Semiconductors Vishay
[四月 25 2023] Vishay Intertechnology has announced the availability of two new seventh generation 1200V FRED Pt® Hyperfast recovery rectifiers --VS E7MH0112-M3 and VS-E7MH0112Hm3. These two 1 A rectifiers are packaged in SMA (DO-214AC) package, with reverse recovery charge (Qrr) and forward voltage drop reaching the advanced level of similar devices. Vishay Semiconductors VS E7MH0112-M3 and the AEC-Q101-certif ...
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With super heat dissipation capacity of gauge level meter attached power device package

2023-04 Semiconductors STMicroelectronics
[四月 25 2023] STMicroelectronics has introduced ACEPACK™ SMIT packaged power semiconductor devices in a variety of common bridge topologies. ST advanced ACEPACK™ SMIT package simplifies assembly and increases module power density compared TO traditional TO packages. This package greatly improves the power density. The area of the top insulation and cooling surface is 32.7mm x 22.5mm, the creepage distance betw ...
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Renesas introduces New Automotive Smart Power Devices

2023-04 Semiconductors Renesas Electronics America
[四月 25 2023] Renesas Electronics announced the launch of a new automotive class Intelligent power device (IPD) that provides safe and flexible control of power distribution within the vehicle to meet the requirements of a new generation of E/E (Electrical/electronic) architecture. The new RAJ2810024H12HPD comes in a small To-252-7 package, which reduces the installation area by about 40% compared TO tradition ...