Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
數百萬庫存的電子零件。 接受缺貨訂單。 24小時內的價格和交貨時間報價。

Technology Articles

記錄 2,852
頁面 172/238
Article Cover

Broadcom introduces breakthrough low-power combination chips for mobile platforms and accessories

2016-08 Semiconductors Broadcom
[八月 17 2016] Broadcom announced the launch of its latest, lowest-power Wi-Fi/ Bluetooth combo chip for mobile platforms and accessories. The BCM43012 extends battery life by up to three times compared to previous Broadcom combos, enabling original equipment manufacturers (Oems) to design a new generation of high-performance connected devices. For more news and information about CES, please visit the Broadcom ...
Article Cover

STMicroelectronics introduces new ToF ranging sensor

2016-08 Sensors STMicroelectronics
[八月 16 2016] STMicroelectronics, a leading global supplier of semiconductors across multiple electronic applications, has announced the second generation of laser ranging sensors. Based on the successful FlightSense technology, the new sensor VL53L0 enables faster, farther, and more accurate distance measurement, significantly improving the photo performance of mobile phones and tablets, and opening up new ap ...
Article Cover

Broadcom unveils new global navigation chip for cars

2016-08 Semiconductors Broadcom
[八月 15 2016] Broadcom announced the addition of a Global Navigation Satellite System (GNSS) wireless connectivity chip to its automotive portfolio. While reducing power consumption for in-vehicle applications, the BCM89774 further improves location and positioning capabilities and reduces bill of materials (BOM) costs for automakers. For more news and information about CES, please visit the Broadcom press roo ...
Article Cover

Broadcom introduces the industry's best-performing NFC controller for mobile payment and transaction applications

2016-08 Connectors Broadcom
[八月 14 2016] Broadcom introduces the industry's best-performing Near Field communication (NFC) controller. The launch of the BCM20797 provides greater transaction coverage, enhanced security and faster transaction speeds, making it ideal for mobile payment and mobile transaction applications. This latest device is part of Broadcom's efforts to provide customers with innovative technologies in the NFC market t ...
Article Cover

Lattice's flexible charging controller supports Qualcomm's fast charging technology

2016-08 Semiconductors Lattice Semiconductor Corporation
[八月 13 2016] Lattice Semiconductor Corporation, a leading provider of customized intelligent interconnect solutions to the market, today announced that Lattice's flexible charging controller, the LIF-UC product family, supports the Qualcomm Quick Charge standard. Qualcomm Technologies introduced Quick Charge 2.0 and 3.0 technologies. As more powerful devices enter the market, faster charging becomes even more ...
Article Cover

The new Cypress Automotive LED driver enables the most compact front lighting system in the industry

2016-08 Semiconductors Cypress Semiconductor
[八月 12 2016] Leds are increasingly being used in automotive front lighting systems, pushing the forecast demand for LED drivers to 120 million units in 2020. With their advantages in power consumption, cost and size, leds have become a common choice for headlights, daytime running lights, width lights, fog lights and turn signals. Cypress Semiconductor has introduced a new LED driver that enables a more compa ...
Article Cover

Microsemi Precision Time Protocol client capacity increased to four times to provide enhanced synchronization performance for LTE networks

2016-08 Power Microsemi
[八月 11 2016] Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions in terms of power consumption, security, reliability and performance, announced the TimeProvider 2700 PTP Master Clock (GM) and TimeProvider for LTE networks The Precision Time Protocol (PTP) capacity of the 2300 edge master clock is quadrupled. The device now provides concurrent hardware timestamp supp ...
Article Cover

STMicroelectronics introduces a new generation of digital audio power amplifier chips for vehicles

2016-08 Connectors STMicroelectronics
[八月 10 2016] Across multiple electronic applications, STMicroelectronics, the world's leading semiconductor supplier, has expanded its leadership in automotive digital audio technology with the launch of the second generation of automotive digital audio power amplifier chips, which will not only help automotive audio system manufacturers simplify amplifier design, but also bring better listening experience to ...
Article Cover

Bluetooth low power module MOPED to achieve simple and safe connection

2016-08 Power Silicon Labs
[八月 9 2016] The Internet of Vehicles is one of the fastest growing application areas of the Internet of Things segment, and according to a report jointly released by the GSMA and SBD, the global Internet of vehicles market will reach 39 billion euros in revenue by 2018, which shows the great potential of the market. The core of car networking is to achieve interconnection, and wireless connection technology ...
Article Cover

Semtech and ST have joined forces to promote LoRa technology to meet the needs of large-scale iot applications

2016-08 Power Semtech
[八月 8 2016] Semtech Corporation and STMicroelectronics, a leading global semiconductor supplier across multiple electronics applications, announced the signing of the Semtech LoRa remote radio frequency technology co-development agreement. With this technology, ST expects to accelerate the deployment of iot applications by mobile network operators (Mnos) and private enterprises. STMicroelectronics will join ...
Article Cover

Microchip's LoRa wireless module is the world's first LoRa Alliance certified

2016-08 Power Microchip Technology
[八月 7 2016] Microchip Technology, the world's leading provider of integrated microcontroller, mixed-signal, emulator and flash memory patented solutions, announced that its RN2483 LoRa module has become the world's first product to pass the LoRa Alliance's LoRaWAN™ certification program. The RN2483 module was independently tested by an Espotel accredited test laboratory and is functionally compliant with the ...
Article Cover

Microsemi Corporation has added new devices to the industry's first family of inductive sensor interface ics based on the LVDT architecture on a PCB

2016-08 Sensors Microsemi
[八月 6 2016] Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions in terms of power consumption, safety, reliability and performance, announced the availability of the LX3302, a new component in its sensor interface integrated circuit (IC) family based on inductive sensing technology. The sensor interface IC family is the industry's first induction sensor interface IC ...