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COSEL introduces ultra-compact, high-efficiency GAN-based power supplies
2023-11
Connectors
Cosel
[十一月 29 2023] The TE series from COSEL is a new generation of highly compact power supplies for industrial applications. Using cutting-edge technologies such as wide bandgap Gallium Nitride (GaN) semiconductors, high-frequency planar transformers, and enhanced flyback topology, the TE series includes 45W (TECS/TEPS45F) and 65W (TECS/TEPS65F) power supplies with 1 x 2.3 (TEPS) and 1 x 3 (TECS) inch footprints, ...
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Ams Osram, together with Meritwork Technology and Enabot, launches intelligent robot EBO X, leading the new trend of family companionship
2023-11
Power
ams
[十一月 28 2023] Ams Osram announced the successful launch of the AI intelligent companion robot EBO X with home robot supplier Enabot through a partnership with Meritwork Technology. The robot relies on the algorithm technology support of Legong Technology and is equipped with AMS OSRAM TMF8821 sensor to achieve automatic obstacle avoidance, anti-fall and auxiliary mapping functions. With the increasing maturity ...
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Microchip has announced the latest TrustAnchor safety IC to meet higher automotive safety certification requirements
2023-11
Semiconductors
Microchip Technology
[十一月 28 2023] As cars continue to become more connected and more technologically advanced, so does the need for enhanced safety measures. The latest cybersecurity specifications from governments and automotive Oems are starting to include larger key sizes and the Edwards Curve ed25519 algorithm standard. To this end, Microchip Technology Inc. is introducing its latest Trust Anchor Security IC, the TA101, to ad ...
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NXP further expands the S32 platform with a software-defined motor control solution for automotive edge nodes
2023-11
Semiconductors
NXP
[十一月 27 2023] NXP Semiconductors announces the S32M2, further expanding the S32 automotive computing platform. Dedicated motor control solutions are optimized to effectively improve the efficiency of automotive applications such as pumps, fans, sunroof and seat positions, seat belt preteners, and backup doors. The S32M2 is based on the S12 MagniV portfolio and combines NXP's motor control technology experience ...
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What benefits can emerging smell sensors bring us?
2023-11
Sensors
Advanced Energy
[十一月 27 2023] Sensors play a crucial role in modern technology, providing machines with the information they need to function properly. This new generation of technology forms part of the Internet of Things (IoT), where machines collect data about themselves and their environment and share it to create a network of autonomous devices. The Internet of Things relies on this sharing of information and feedback, a ...
NXP introduces software-defined motor control solutions for automotive edge nodes
2023-11
Semiconductors
NXP
[十一月 24 2023] NXP Semiconductors announces the S32M2, further expanding the S32 automotive computing platform. Dedicated motor control solutions are optimized to effectively improve the efficiency of automotive applications such as pumps, fans, sunroof and seat positions, seat belt preteners, and backup doors. The S32M2 is based on the S12 MagniV portfolio and combines NXP's motor control technology experience ...
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Intel unveils Climate Change Action Plan
2023-11
Power
Intel
[十一月 24 2023] Intel's Climate Transformation Action Plan details Intel's path to reducing its carbon footprint. Accompanying the announcement was a letter from Intel CEO Pat Kissinger detailing the report and outlining Intel's commitment to advancing sustainable business practices. The world is expanding rapidly, and computing power has become the foundation for more opportunities and a better future for every ...
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Infineon trials Archetype AI's new AI developer model to strengthen innovation in AI sensor solutions
2023-11
Power
Infineon Technologies
[十一月 22 2023] Infineon Technologies AG, a semiconductor leader in spherical power systems and the Internet of Things, and Archetype AI, a pioneer of AI in the physical world, have signed a strategic cooperation agreement to accelerate the development of AI-enabled sensor chips that will make people's lives easier, safer and more environmentally friendly. Archetype AI, based in Silicon Valley, is a cutting-edge ...
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Nexperia enters strategic partnership with Mitsubishi Electric for SiC MOSFET discrete products
2023-11
Power
Nexperia
[十一月 22 2023] Nexperia announced a strategic partnership with Mitsubishi Electric Corporation to jointly develop silicon carbide (SiC) MOSFET discrete products. Nexperia and Mitsubishi Electric, both leaders in their respective industries, have teamed up to develop technologies that will drive the energy efficiency and performance of SiC wide band gap semiconductors to new heights, while meeting the rapidly gr ...
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Infineon has partnered with DH-Robotics to launch a new generation of electric grabpers
2023-11
Power
Infineon Technologies
[十一月 20 2023] Electric grippers offer precise control, adaptability, safety, and energy efficiency, making them indispensable in industries that require handling delicate components with accuracy. Robotic arms significantly enhance the productivity and security of industrial production lines. Traditional pneumatic grippers hinder the implementation of a more intelligent and sustainable manufacturing future, ne ...
STMicroelectronics introduces automotive SiC power modules in dual-inline package
2023-11
Semiconductors
STMicroelectronics
[十一月 20 2023] STMicroelectronics has introduced the 32-pin, dual-inline, molded, through-hole ACEPACK DMT-32 family of SiC power modules for automotive applications. Designed for systems such as onboard chargers (OBC), DC/DC converters, fluid pumps, and air conditioning, these components feature a high-power density, a very compact design, and a simplified assembly process. The product family provides system d ...
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Renesas unveils next generation Automotive SoC and MCU processor product roadmap
2023-11
Connectors
Renesas Electronics America
[十一月 16 2023] Renesas has pre-announced information about the fifth-generation R-Car SoC for high-performance applications, which uses advanced Chiplet small chip package integration technology to bring greater design flexibility to vehicle engineers. For example, if advanced driver assistance systems (ADAS) need to accommodate more prominent AI performance, engineers can integrate AI accelerators into a singl ...